Tatsuo NISHIZAWA

Person

Matsumoto-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging structure for bipolar transistor with constricted bumps
- Patent number 11,705,419
- Issue date Jul 18, 2023
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having block electrode bonded to collector ele...
- Patent number 11,545,409
- Issue date Jan 3, 2023
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,171,078
- Issue date Nov 9, 2021
- Fuji Electric Co., Ltd.
- Yuichiro Hinata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having terminal pin connected by connecting me...
- Patent number 11,133,609
- Issue date Sep 28, 2021
- Fuji Electric Co., Ltd.
- Yuichiro Hinata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor module manufacturing method
- Patent number 11,037,848
- Issue date Jun 15, 2021
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,991,650
- Issue date Apr 27, 2021
- Fuji Electric Co., Ltd.
- Tatsuo Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,923,414
- Issue date Feb 16, 2021
- Fuji Electric Co., Ltd.
- Hideyo Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,446,460
- Issue date Oct 15, 2019
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,109,603
- Issue date Oct 23, 2018
- Fuji Electric Co., Ltd.
- Tatsuo Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,999,146
- Issue date Jun 12, 2018
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,824,950
- Issue date Nov 21, 2017
- Fuji Electric Co., Ltd.
- Kyohei Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,786,587
- Issue date Oct 10, 2017
- Fuji Electric Co., Ltd.
- Tatsuo Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for installing heat dissipation member...
- Patent number 9,711,430
- Issue date Jul 18, 2017
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacturing electronic component
- Patent number 9,627,342
- Issue date Apr 18, 2017
- Fuji Electric Co., Ltd.
- Takashi Saito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermocompression bonding structure and thermocompression bonding m...
- Patent number 9,579,746
- Issue date Feb 28, 2017
- Fuji Electric Co., Ltd.
- Yoshito Kinoshita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,406,603
- Issue date Aug 2, 2016
- Fuji Electric Co., Ltd.
- Tatsuo Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 9,385,103
- Issue date Jul 5, 2016
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method for electronic component
- Patent number 9,355,987
- Issue date May 31, 2016
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing same
- Patent number 9,299,642
- Issue date Mar 29, 2016
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,944,310
- Issue date Feb 3, 2015
- Fuji Electric Co., Ltd.
- Takeshi Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number D689833
- Issue date Sep 17, 2013
- Fuji Electric Co., Ltd.
- Motohito Hori
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Soldering method and method of manufacturing semiconductor device i...
- Patent number 8,273,644
- Issue date Sep 25, 2012
- Fuji Electric Co., Ltd.
- Kazunaga Onishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor module
- Patent number 7,985,630
- Issue date Jul 26, 2011
- Fuji Electric Device Technology Co., Ltd.
- Masafumi Horio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 7,944,042
- Issue date May 17, 2011
- Fuji Electric Device Technology Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 7,902,653
- Issue date Mar 8, 2011
- Fuji Electric Systems Co., Ltd.
- Masafumi Horio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motor drive apparatus and motor driving method capable of simply re...
- Patent number 6,008,619
- Issue date Dec 28, 1999
- NEC Corporation
- Makoto Murase
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Read/write amplifier circuit for magnetic disk unit
- Patent number 5,327,297
- Issue date Jul 5, 1994
- NEC Corporation
- Hiroyuki Enami
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD
- Publication number 20250112143
- Publication date Apr 3, 2025
- Fuji Electric Co., Ltd.
- Kohei YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006622
- Publication date Jan 2, 2025
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240055422
- Publication date Feb 15, 2024
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240055391
- Publication date Feb 15, 2024
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFUCTURING METHOD OF PACKAGING STRUCTURE FOR BIPOLAR TRANSISTOR...
- Publication number 20230307400
- Publication date Sep 28, 2023
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
- Publication number 20210242156
- Publication date Aug 5, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
- Publication number 20210242103
- Publication date Aug 5, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210020554
- Publication date Jan 21, 2021
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200091634
- Publication date Mar 19, 2020
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190287887
- Publication date Sep 19, 2019
- Fuji Electric Co., Ltd.
- Hideyo NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190273041
- Publication date Sep 5, 2019
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
- Publication number 20190189529
- Publication date Jun 20, 2019
- Fuji Electric Co., Ltd.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180315676
- Publication date Nov 1, 2018
- Fuji Electric Co., Ltd.
- Hiromichi GOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170271280
- Publication date Sep 21, 2017
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20170181300
- Publication date Jun 22, 2017
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20160322287
- Publication date Nov 3, 2016
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20150371931
- Publication date Dec 24, 2015
- Fuji Electric Co., Ltd.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150187671
- Publication date Jul 2, 2015
- Fuji Electric Co., Ltd.
- Kyohei FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT
- Publication number 20140374775
- Publication date Dec 25, 2014
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR INSTALLING HEAT DISSIPATION MEMBER...
- Publication number 20140374896
- Publication date Dec 25, 2014
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING WEIGHT
- Publication number 20140312102
- Publication date Oct 23, 2014
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING STRUCTURE AND THERMOCOMPRESSION BONDING M...
- Publication number 20140301769
- Publication date Oct 9, 2014
- Fuji Electric Co., Ltd.
- Yoshito KINOSHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140246783
- Publication date Sep 4, 2014
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140224862
- Publication date Aug 14, 2014
- Fuji Electric Co., Ltd.
- Takeshi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20140001636
- Publication date Jan 2, 2014
- Fuji Electric Co., Ltd.
- Takashi SAITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for manufacturing semiconductor module
- Publication number 20110059581
- Publication date Mar 10, 2011
- Fuji Electric Device Technology Co., Ltd.
- Masafumi Horio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and method for manufacturing semiconductor module
- Publication number 20080284007
- Publication date Nov 20, 2008
- Fuji Electric Device Technology Co., LTD.
- Masafumi Horio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20080217760
- Publication date Sep 11, 2008
- Fuji Electric Device Technology Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE I...
- Publication number 20080206928
- Publication date Aug 28, 2008
- Fuji Electric Device Technology Co., LTD.
- Kazunaga ONISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Tatsuo NISHIZAWA

Person

Patents Grantslast 30 patents

Packaging structure for bipolar transistor with constricted bumps

Semiconductor module having block electrode bonded to collector ele...

Semiconductor device and method for manufacturing the same

Semiconductor device having terminal pin connected by connecting me...

Semiconductor module and semiconductor module manufacturing method

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device

Semiconductor device

Semiconductor module

Semiconductor device

Semiconductor device and method for manufacturing the semiconductor...

Semiconductor device, method for installing heat dissipation member...

Electronic component and method of manufacturing electronic component

Thermocompression bonding structure and thermocompression bonding m...

Semiconductor device and method for manufacturing the semiconductor...

Semiconductor device manufacturing method

Electronic component and manufacturing method for electronic component

Semiconductor device and method for producing same

Method of manufacturing a semiconductor device

Semiconductor device

Soldering method and method of manufacturing semiconductor device i...

Method for manufacturing semiconductor module

Semiconductor device and method of manufacturing same

Semiconductor module

Motor drive apparatus and motor driving method capable of simply re...

Read/write amplifier circuit for magnetic disk unit

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

MANUFUCTURING METHOD OF PACKAGING STRUCTURE FOR BIPOLAR TRANSISTOR...

SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE, METHOD FOR INSTALLING HEAT DISSIPATION MEMBER...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING WEIGHT

THERMOCOMPRESSION BONDING STRUCTURE AND THERMOCOMPRESSION BONDING M...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

Method for manufacturing semiconductor module

Semiconductor module and method for manufacturing semiconductor module

Semiconductor device and method of manufacturing same

SOLDERING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE I...