Tatsuo OGAWA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for mounting light-emitting element and light-emitting de...
- Patent number 9,076,714
- Issue date Jul 7, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing flexible semiconductor device having gate...
- Patent number 8,895,373
- Issue date Nov 25, 2014
- Panasonic Corporation
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device having gate electrode disposed within...
- Patent number 8,581,247
- Issue date Nov 12, 2013
- Panasonic Corporation
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device
- Patent number 8,525,172
- Issue date Sep 3, 2013
- Panasonic Corporation
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing flexible semiconductor device
- Patent number 8,435,842
- Issue date May 7, 2013
- Panasonic Corporation
- Koichi Hirano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Flexible semiconductor device and method for manufacturing same
- Patent number 8,343,822
- Issue date Jan 1, 2013
- Panasonic Corporation
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, method for manufacturing the same, and semiconductor...
- Patent number 8,063,486
- Issue date Nov 22, 2011
- Panasonic Corporation
- Koichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 6,326,694
- Issue date Dec 4, 2001
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 6,211,487
- Issue date Apr 3, 2001
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste for filling via-hole, double-sided and multilayer...
- Patent number 6,139,777
- Issue date Oct 31, 2000
- Matsushita Electric Industrial Co., Ltd.
- Kazunori Omoya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting member of a circuit substrate and method of manufacturin...
- Patent number 6,108,903
- Issue date Aug 29, 2000
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste composition for via hole filling and printed circu...
- Patent number 6,096,411
- Issue date Aug 1, 2000
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,977,490
- Issue date Nov 2, 1999
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 5,972,482
- Issue date Oct 26, 1999
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,914,358
- Issue date Jun 22, 1999
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,733,467
- Issue date Mar 31, 1998
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,652,042
- Issue date Jul 29, 1997
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting member of a circuit substrate and method of manufacturin...
- Patent number 5,484,647
- Issue date Jan 16, 1996
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser trimable capacitor
- Patent number 5,159,524
- Issue date Oct 27, 1992
- Matsushita Electric Industrial Co., Ltd.
- Yo Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME
- Publication number 20150084080
- Publication date Mar 26, 2015
- PANASONIC CORPORATION
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE HAVING GATE...
- Publication number 20140038366
- Publication date Feb 6, 2014
- PANASONIC CORPORATION
- Takeshi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130168677
- Publication date Jul 4, 2013
- PANASONIC CORPORATION
- Koichi HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING THE...
- Publication number 20120319159
- Publication date Dec 20, 2012
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20120001173
- Publication date Jan 5, 2012
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100283054
- Publication date Nov 11, 2010
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE
- Publication number 20100261321
- Publication date Oct 14, 2010
- Koichi Hirano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR...
- Publication number 20070262447
- Publication date Nov 15, 2007
- Matsushita Electric Industrial Co., Ltd.
- Koichi HIRANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board
- Publication number 20070137890
- Publication date Jun 21, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hiroyoshi Tagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board
- Publication number 20040012935
- Publication date Jan 22, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroyoshi Tagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting member of a circuit substrate and method of manufacturin...
- Publication number 20010003610
- Publication date Jun 14, 2001
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20010002294
- Publication date May 31, 2001
- Akihito Hatakeyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Tatsuo OGAWA

Person

Patents Grantslast 30 patents

Substrate for mounting light-emitting element and light-emitting de...

Method for manufacturing flexible semiconductor device having gate...

Flexible semiconductor device having gate electrode disposed within...

Flexible semiconductor device

Method for manufacturing flexible semiconductor device

Flexible semiconductor device and method for manufacturing same

Circuit board, method for manufacturing the same, and semiconductor...

Printed circuit board

Printed circuit board and method of manufacturing the same

Conductive paste for filling via-hole, double-sided and multilayer...

Connecting member of a circuit substrate and method of manufacturin...

Conductive paste composition for via hole filling and printed circu...

Conductive paste compound for via hole filling, printed circuit boa...

Printed circuit board and method of manufacturing the same

Conductive paste compound for via hole filling, printed circuit boa...

Conductive paste compound for via hole filling, printed circuit boa...

Conductive paste compound for via hole filling, printed circuit boa...

Connecting member of a circuit substrate and method of manufacturin...

Laser trimable capacitor

Patents Applicationslast 30 patents

LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE HAVING GATE...

FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SUBSTRATE FOR LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING THE...

FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR...

Printed wiring board

Printed wiring board

Connecting member of a circuit substrate and method of manufacturin...

Printed circuit board and method of manufacturing the same