Tatsuo Sasaoka

Person

Osaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermoelectric conversion substrate, thermoelectric conversion modu...
- Patent number 11,056,632
- Issue date Jul 6, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takuji Aoyama
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Electronic component
- Patent number 11,011,319
- Issue date May 18, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shinji Ishitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor package in a wiring board...
- Patent number 10,679,920
- Issue date Jun 9, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and production method thereof
- Patent number 10,629,792
- Issue date Apr 21, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuo Sasaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure, and method of manufacturing mounting structure
- Patent number 9,246,073
- Issue date Jan 26, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuo Sasaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated semiconductor device and method for manufacturing the...
- Patent number 9,240,369
- Issue date Jan 19, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor device and method for manufacturing the...
- Patent number 9,030,003
- Issue date May 12, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joined body having an anti-corrosion film formed around a junction...
- Patent number 9,013,029
- Issue date Apr 21, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masanori Minamio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,686,545
- Issue date Apr 1, 2014
- Panasonic Corporation
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining apparatus with UV cleaning
- Patent number 8,240,539
- Issue date Aug 14, 2012
- Panasonic Corporation
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive component incorporating interposer
- Patent number 7,968,800
- Issue date Jun 28, 2011
- Panasonic Corporation
- Tatsuo Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bare chip mounted structure and mounting method
- Patent number 7,907,420
- Issue date Mar 15, 2011
- Panasonic Corporation
- Koichi Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method and apparatus
- Patent number 7,659,148
- Issue date Feb 9, 2010
- Panasonic Corporation
- Tatsuo Sasaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part mounting apparatus and method
- Patent number 6,996,889
- Issue date Feb 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure plasma processing apparatus and method
- Patent number 6,949,144
- Issue date Sep 27, 2005
- Matsushita Electric Industrial Co., Ltd.
- Tatsuo Sasaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding method apparatus
- Patent number 6,902,101
- Issue date Jun 7, 2005
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and apparatus
- Patent number 6,712,111
- Issue date Mar 30, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bare chip mounting method and bare chip mounting system
- Patent number 6,680,221
- Issue date Jan 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film substrate treatment apparatus, film substrate treatment method...
- Patent number 6,667,250
- Issue date Dec 23, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tatsuo Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 6,474,538
- Issue date Nov 5, 2002
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20190333707
- Publication date Oct 31, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- SHINJI ISHITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190229029
- Publication date Jul 25, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- HIDEKI NIIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC CONVERSION SUBSTRATE, THERMOELECTRIC CONVERSION MODU...
- Publication number 20190081229
- Publication date Mar 14, 2019
- Panasonic Intellectual Property Management Co., Lt
- TAKUJI AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND PRODUCTION METHOD THEREOF
- Publication number 20180366628
- Publication date Dec 20, 2018
- Panasonic Intellectual Property Managenemt Co., Ltd.
- TATSUO SASAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL
- Publication number 20170341188
- Publication date Nov 30, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- SHINJI ISHITANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20150235928
- Publication date Aug 20, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Masanori MINAMIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINED BODY, POWER SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS...
- Publication number 20130221502
- Publication date Aug 29, 2013
- PANASONIC CORPORATION
- Masanori Minamio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20130056885
- Publication date Mar 7, 2013
- PANASONIC CORPORATION
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120161302
- Publication date Jun 28, 2012
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE, AND METHOD OF MANUFACTURING MOUNTING STRUCTURE
- Publication number 20110114706
- Publication date May 19, 2011
- PANASONIC CORPORATION
- Tatsuo Sasaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE COMPONENT INCORPORATING INTERPOSER
- Publication number 20100155119
- Publication date Jun 24, 2010
- Matsushita Electric Industrial Co., Ltd.
- Tatsuo Sasaoka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Bare Chip Mounted Structure and Mounting Method
- Publication number 20080192423
- Publication date Aug 14, 2008
- Matsushita Electric Industrial Co., Ltd.
- Koichi Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method and apparatus
- Publication number 20070193682
- Publication date Aug 23, 2007
- Matsushita Electric Industrial Co., Ltd.
- Tatsuo Sasaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic part mounting apparatus and method
- Publication number 20060081974
- Publication date Apr 20, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining apparatus and method
- Publication number 20060037997
- Publication date Feb 23, 2006
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low pressure plasma processing apparatus and method
- Publication number 20040084148
- Publication date May 6, 2004
- Tatsuo Sasaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic part mounting apparatus and method
- Publication number 20040022037
- Publication date Feb 5, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Film substrate treatment apparatus, film substrate treatment method...
- Publication number 20030183339
- Publication date Oct 2, 2003
- Matsushita Elec. Ind. Co. Ltd.
- Tatsuo Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump bonding method and apparatue
- Publication number 20030094481
- Publication date May 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bare chip mounting method and bare chip mounting system
- Publication number 20030096451
- Publication date May 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method and apparatus
- Publication number 20020125303
- Publication date Sep 12, 2002
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS

Tatsuo Sasaoka

Person

Patents Grantslast 30 patents

Thermoelectric conversion substrate, thermoelectric conversion modu...

Electronic component

Semiconductor device having semiconductor package in a wiring board...

Wiring substrate and production method thereof

Mounting structure, and method of manufacturing mounting structure

Encapsulated semiconductor device and method for manufacturing the...

Encapsulated semiconductor device and method for manufacturing the...

Joined body having an anti-corrosion film formed around a junction...

Semiconductor device and method for manufacturing the same

Joining apparatus with UV cleaning

Passive component incorporating interposer

Bare chip mounted structure and mounting method

Bonding method and apparatus

Electronic part mounting apparatus and method

Low pressure plasma processing apparatus and method

Bump bonding method apparatus

Bonding method and apparatus

Bare chip mounting method and bare chip mounting system

Film substrate treatment apparatus, film substrate treatment method...

Bonding apparatus and bonding method

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE

THERMOELECTRIC CONVERSION SUBSTRATE, THERMOELECTRIC CONVERSION MODU...

WIRING SUBSTRATE AND PRODUCTION METHOD THEREOF

SOLDER MATERIAL

ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

JOINED BODY, POWER SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS...

ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MOUNTING STRUCTURE, AND METHOD OF MANUFACTURING MOUNTING STRUCTURE

PASSIVE COMPONENT INCORPORATING INTERPOSER

Bare Chip Mounted Structure and Mounting Method

Bonding method and apparatus

Electronic part mounting apparatus and method

Joining apparatus and method

Low pressure plasma processing apparatus and method

Electronic part mounting apparatus and method

Film substrate treatment apparatus, film substrate treatment method...

Bump bonding method and apparatue

Bare chip mounting method and bare chip mounting system

Bonding method and apparatus