Tatsuo Suemasu

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing microfluidic chip, microfluidic chip, and a...
- Patent number 8,652,419
- Issue date Feb 18, 2014
- Fujikura Ltd.
- Satoshi Yamamoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor apparatus having a through-hole interconnection
- Patent number 8,564,101
- Issue date Oct 22, 2013
- Sony Corporation
- Yoshimichi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor apparatus having a through...
- Patent number 8,273,657
- Issue date Sep 25, 2012
- Sony Corporation
- Yoshimichi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a through-hole interconnection substrate
- Patent number 7,814,651
- Issue date Oct 19, 2010
- Fujikura Ltd.
- Tatsuo Suemasu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,368,321
- Issue date May 6, 2008
- Fujikura Ltd.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,274,101
- Issue date Sep 25, 2007
- Fujikura Ltd.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a through-hole interconnection substrate and...
- Patent number 7,217,890
- Issue date May 15, 2007
- Fujikura, Ltd.
- Tatsuo Suemasu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with through-hole
- Patent number 7,180,149
- Issue date Feb 20, 2007
- Fujikura Ltd.
- Satoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor pressure sensor
- Patent number 7,080,560
- Issue date Jul 25, 2006
- Fujikura Ltd.
- Takashi Takizawa
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of a semiconductor substrate provided with a t...
- Patent number 7,022,609
- Issue date Apr 4, 2006
- Fujikura Ltd.
- Satoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal filling method and member with filled metal sections
- Patent number 6,743,499
- Issue date Jun 1, 2004
- Fujikura Ltd.
- Tatsuo Suemasu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING MICROFLUIDIC CHIP, MICROFLUIDIC CHIP, AND A...
- Publication number 20130140976
- Publication date Jun 6, 2013
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110290545
- Publication date Dec 1, 2011
- FUJIKURA LTD.
- Hideyuki WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110136342
- Publication date Jun 9, 2011
- SONY CORPORATION
- Yoshimichi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20100117220
- Publication date May 13, 2010
- FUJIKURA LTD.
- Sayaka HIRAFUNE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090200679
- Publication date Aug 13, 2009
- SONY CORPORATION
- Yoshimichi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20070264753
- Publication date Nov 15, 2007
- FUJIKURA LTD.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THROUGH-HOLE INTERCONNECTION SUBSTRATE AND...
- Publication number 20070187142
- Publication date Aug 16, 2007
- FUJIKURA LTD.
- Tatsuo SUEMASU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal filling process and metal filling apparatus
- Publication number 20060113057
- Publication date Jun 1, 2006
- FUJIKURA LTD.
- Sayaka Hirafune
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20060001147
- Publication date Jan 5, 2006
- FUJIKURA LTD.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device with through-hole interconnection and method for manufacturi...
- Publication number 20050205997
- Publication date Sep 22, 2005
- FUJIKURA LTD.
- Satoshi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and method of manufacturing same
- Publication number 20050056903
- Publication date Mar 17, 2005
- Satoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal filling method and memeber with filled metal sections
- Publication number 20040187975
- Publication date Sep 30, 2004
- FUJIKURA LTD.
- Tatsuo Suemasu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor pressure sensor
- Publication number 20040103724
- Publication date Jun 3, 2004
- FUJIKURA LTD.
- Takashi Takizawa
- G01 - MEASURING TESTING
Information Patent Application
Method for fabricating a through-hole interconnection substrate and...
- Publication number 20040092117
- Publication date May 13, 2004
- FUJIKURA LTD.
- Tatsuo Suemasu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of a semiconductor substrate provided with a t...
- Publication number 20040043615
- Publication date Mar 4, 2004
- FUJIKURA LTD.
- Satoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal filling method and member with filled metal sections
- Publication number 20030082356
- Publication date May 1, 2003
- FUJIKURA LTD.
- Tatsuo Suemasu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tatsuo Suemasu

Person

Patents Grantslast 30 patents

Method of manufacturing microfluidic chip, microfluidic chip, and a...

Semiconductor apparatus having a through-hole interconnection

Method for manufacturing a semiconductor apparatus having a through...

Method for fabricating a through-hole interconnection substrate

Semiconductor package and method for manufacturing the same

Semiconductor package and method for manufacturing the same

Method for fabricating a through-hole interconnection substrate and...

Semiconductor package with through-hole

Semiconductor pressure sensor

Manufacturing method of a semiconductor substrate provided with a t...

Metal filling method and member with filled metal sections

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING MICROFLUIDIC CHIP, MICROFLUIDIC CHIP, AND A...

THROUGH WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

Semiconductor package and method for manufacturing the same

METHOD FOR FABRICATING A THROUGH-HOLE INTERCONNECTION SUBSTRATE AND...

Metal filling process and metal filling apparatus

Semiconductor package and method for manufacturing the same

Device with through-hole interconnection and method for manufacturi...

Semiconductor package and method of manufacturing same

Metal filling method and memeber with filled metal sections

Semiconductor pressure sensor

Method for fabricating a through-hole interconnection substrate and...

Manufacturing method of a semiconductor substrate provided with a t...

Metal filling method and member with filled metal sections