Tatsuro SAWATARI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 10,681,820
- Issue date Jun 9, 2020
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module
- Patent number 9,818,780
- Issue date Nov 14, 2017
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with built-in electronic component
- Patent number 9,363,897
- Issue date Jun 7, 2016
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing substrate having cavity
- Patent number 9,301,407
- Issue date Mar 29, 2016
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Camera module
- Patent number 9,253,386
- Issue date Feb 2, 2016
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit module having electrical shield
- Patent number 9,101,050
- Issue date Aug 4, 2015
- Taiyo Yuden Co., Ltd.
- Masaya Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in component
- Patent number 9,101,075
- Issue date Aug 4, 2015
- Taiyo Yuden Co., Ltd.
- Masaki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in electronic component
- Patent number 9,078,370
- Issue date Jul 7, 2015
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in electronic component
- Patent number 9,055,671
- Issue date Jun 9, 2015
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in electronic component
- Patent number 9,007,782
- Issue date Apr 14, 2015
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit module and method for producing the same
- Patent number 8,988,885
- Issue date Mar 24, 2015
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in electronic component
- Patent number 8,964,407
- Issue date Feb 24, 2015
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in electronic component
- Patent number 8,923,009
- Issue date Dec 30, 2014
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite multi-layer substrate and module using the substrate
- Patent number RE45146
- Issue date Sep 23, 2014
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- 257 - Active solid-state devices
Information Patent Grant
Electronic circuit module
- Patent number 8,811,021
- Issue date Aug 19, 2014
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer board incorporating electronic component and method for...
- Patent number 8,314,343
- Issue date Nov 20, 2012
- Taiyo Yuden Co., Ltd.
- Yusuke Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite multi-layer substrate and module using the substrate
- Patent number 7,928,560
- Issue date Apr 19, 2011
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite multi-layer substrate and module using the substrate
- Patent number 7,745,926
- Issue date Jun 29, 2010
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate including components therein
- Patent number 7,738,256
- Issue date Jun 15, 2010
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate including components therein
- Patent number 7,379,306
- Issue date May 27, 2008
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite multi-layer substrate and module using the substrate
- Patent number 7,348,662
- Issue date Mar 25, 2008
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and production method therefor
- Patent number 7,278,205
- Issue date Oct 9, 2007
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20190274220
- Publication date Sep 5, 2019
- Taiyo Yuden Co., Ltd.
- TATSURO SAWATARI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20150098203
- Publication date Apr 9, 2015
- Taiyo Yuden Co., Ltd.
- Tatsuro SAWATARI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND CORE BASE-MATERIAL...
- Publication number 20150068795
- Publication date Mar 12, 2015
- Taiyo Yuden Co., Ltd.
- Kazuaki IDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN COMPONENT
- Publication number 20150070862
- Publication date Mar 12, 2015
- Taiyo Yuden Co., Ltd.
- Masaki NAGANUMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20150049439
- Publication date Feb 19, 2015
- Taiyo Yuden Co., Ltd.
- Masaya SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE HAVING CAVITY
- Publication number 20150010694
- Publication date Jan 8, 2015
- Taiyo Yuden Co., Ltd.
- Masashi MIYAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20140355232
- Publication date Dec 4, 2014
- Tatsuro SAWATARI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20140307402
- Publication date Oct 16, 2014
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20140285988
- Publication date Sep 25, 2014
- Taiyo Yuden Co., Ltd.
- Tatsuro SAWATARI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE
- Publication number 20140253794
- Publication date Sep 11, 2014
- Taiyo Yuden Co., Ltd.
- Masashi MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE
- Publication number 20140252522
- Publication date Sep 11, 2014
- Taiyo Yuden Co., Ltd.
- Masashi MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20140133120
- Publication date May 15, 2014
- Tatsuro SAWATARI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT MODULE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140126157
- Publication date May 8, 2014
- Taiyo Yuden Co., Ltd.
- Tatsuro SAWATARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20140126160
- Publication date May 8, 2014
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20140049928
- Publication date Feb 20, 2014
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20140048321
- Publication date Feb 20, 2014
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE MULTI-LAYER SUBSTRATE AND MODULE USING THE SUBSTRATE
- Publication number 20100300736
- Publication date Dec 2, 2010
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER BOARD INCORPORATING ELECTRONIC COMPONENT AND METHOD FOR...
- Publication number 20090084596
- Publication date Apr 2, 2009
- Taiyo Yuden Co., Ltd.
- Yusuke INOUE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER SUBSTRATE INCLUDING COMPONENTS THEREIN
- Publication number 20080196932
- Publication date Aug 21, 2008
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite multi-layer substrate and module using the substrate
- Publication number 20080006928
- Publication date Jan 10, 2008
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and production method therefor
- Publication number 20070029109
- Publication date Feb 8, 2007
- Masashi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite multi-layer substrate and module using the substrate
- Publication number 20060255440
- Publication date Nov 16, 2006
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and production method therefor
- Publication number 20060016620
- Publication date Jan 26, 2006
- Masashi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer substrate including components therein
- Publication number 20050255303
- Publication date Nov 17, 2005
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tatsuro SAWATARI

Person

Patents Grantslast 30 patents

Circuit board and manufacturing method therefor

Camera module

Substrate with built-in electronic component

Method of manufacturing substrate having cavity

Camera module

Circuit module having electrical shield

Substrate with built-in component

Substrate with built-in electronic component

Substrate with built-in electronic component

Substrate with built-in electronic component

Electronic circuit module and method for producing the same

Substrate with built-in electronic component

Substrate with built-in electronic component

Composite multi-layer substrate and module using the substrate

Electronic circuit module

Multi-layer board incorporating electronic component and method for...

Composite multi-layer substrate and module using the substrate

Composite multi-layer substrate and module using the substrate

Multilayer substrate including components therein

Multilayer substrate including components therein

Composite multi-layer substrate and module using the substrate

Multilayer printed wiring board and production method therefor

Patents Applicationslast 30 patents

CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND CORE BASE-MATERIAL...

SUBSTRATE WITH BUILT-IN COMPONENT

CIRCUIT MODULE

METHOD OF MANUFACTURING SUBSTRATE HAVING CAVITY

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

CAMERA MODULE

CAMERA MODULE

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

ELECTRONIC CIRCUIT MODULE AND METHOD FOR PRODUCING THE SAME

ELECTRONIC CIRCUIT MODULE

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

COMPOSITE MULTI-LAYER SUBSTRATE AND MODULE USING THE SUBSTRATE

MULTI-LAYER BOARD INCORPORATING ELECTRONIC COMPONENT AND METHOD FOR...

MULTILAYER SUBSTRATE INCLUDING COMPONENTS THEREIN

Composite multi-layer substrate and module using the substrate

Multilayer printed wiring board and production method therefor

Composite multi-layer substrate and module using the substrate

Multilayer printed wiring board and production method therefor

Multilayer substrate including components therein