TATSUYA ARISAWA

Person

Fukushima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper-clad laminate, wiring board, and copper foil with resin
- Patent number 12,109,779
- Issue date Oct 8, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper-clad laminate, wiring board, and copper foil provided with r...
- Patent number 11,895,770
- Issue date Feb 6, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-clad laminated board, metal member provided with resin, and w...
- Patent number 11,330,710
- Issue date May 10, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Arisawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, film including resin, metal foil includ...
- Patent number 11,312,858
- Issue date Apr 26, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Arisawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-clad laminated board, method for producing metal-clad laminat...
- Patent number 11,267,225
- Issue date Mar 8, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Arisawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, method for producing resin composition, prepreg,...
- Patent number 11,078,361
- Issue date Aug 3, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Arisawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-clad laminate, metal member with resin, and wiring board
- Patent number 10,820,413
- Issue date Oct 27, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition for printed wiring board, prepreg, metal-clad lam...
- Patent number 9,775,239
- Issue date Sep 26, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Arisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...
- Publication number 20240279434
- Publication date Aug 22, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shinichi KATSUTA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METAL-CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND...
- Publication number 20230094806
- Publication date Mar 30, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Akira IRIFUNE
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN
- Publication number 20230054257
- Publication date Feb 23, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki INOUE
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL PROVIDED WITH R...
- Publication number 20220015230
- Publication date Jan 13, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CLAD LAMINATE, WIRING BOARD, METAL FOIL PROVIDED WITH RESIN,...
- Publication number 20210395452
- Publication date Dec 23, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Tatsuya ARISAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM INCLUDING RESIN, METAL FOIL INCLUD...
- Publication number 20210079215
- Publication date Mar 18, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Tatsuya ARISAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL-CLAD LAMINATED BOARD, METAL MEMBER PROVIDED WITH RESIN, AND W...
- Publication number 20210014967
- Publication date Jan 14, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Tatsuya ARISAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METAL-CLAD LAMINATED BOARD, METHOD FOR PRODUCING METAL-CLAD LAMINAT...
- Publication number 20190270280
- Publication date Sep 5, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TATSUYA ARISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, PREPREG,...
- Publication number 20190203045
- Publication date Jul 4, 2019
- Panasonic Intellectual Property Management Co., Lt d.
- Tatsuya ARISAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL-CLAD LAMINATE, METAL MEMBER WITH RESIN, AND WIRING BOARD
- Publication number 20190014661
- Publication date Jan 10, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- YUKI INOUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL-CLAD LAM...
- Publication number 20170099731
- Publication date Apr 6, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- TATSUYA ARISAWA
- B32 - LAYERED PRODUCTS

TATSUYA ARISAWA

Person

Patents Grantslast 30 patents

Copper-clad laminate, wiring board, and copper foil with resin

Copper-clad laminate, wiring board, and copper foil provided with r...

Metal-clad laminated board, metal member provided with resin, and w...

Resin composition, prepreg, film including resin, metal foil includ...

Metal-clad laminated board, method for producing metal-clad laminat...

Resin composition, method for producing resin composition, prepreg,...

Metal-clad laminate, metal member with resin, and wiring board

Resin composition for printed wiring board, prepreg, metal-clad lam...

Patents Applicationslast 30 patents

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...

METAL-CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND...

COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN

COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL PROVIDED WITH R...

METAL-CLAD LAMINATE, WIRING BOARD, METAL FOIL PROVIDED WITH RESIN,...

RESIN COMPOSITION, PREPREG, FILM INCLUDING RESIN, METAL FOIL INCLUD...

METAL-CLAD LAMINATED BOARD, METAL MEMBER PROVIDED WITH RESIN, AND W...

METAL-CLAD LAMINATED BOARD, METHOD FOR PRODUCING METAL-CLAD LAMINAT...

RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, PREPREG,...

METAL-CLAD LAMINATE, METAL MEMBER WITH RESIN, AND WIRING BOARD

RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL-CLAD LAM...