Tatsuya IWASA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 9,445,497
- Issue date Sep 13, 2016
- Mitsubishi Electric Corporation
- Daisuke Oya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sealed semiconductor device and manufacturing method therefor
- Patent number 8,785,252
- Issue date Jul 22, 2014
- Mitsubishi Electric Corporation
- Masafumi Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device and manufacturing method therefor
- Patent number 8,399,976
- Issue date Mar 19, 2013
- Mitsubishi Electric Corporation
- Masafumi Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160113112
- Publication date Apr 21, 2016
- Mitsubishi Electric Corporation
- Daisuke OYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin Sealed Semiconductor Device And Manufacturing Method Therefor
- Publication number 20130143365
- Publication date Jun 6, 2013
- Masafumi MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20090212411
- Publication date Aug 27, 2009
- Mitsubishi Electric Corporation
- Masafumi MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS