Tatsuya Kanamaru

Person

Gunma-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition, die attach method using same, and semicond...
- Patent number 8,815,400
- Issue date Aug 26, 2014
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Kanamaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition suitable to be applied by screen printing
- Patent number 8,110,066
- Issue date Feb 7, 2012
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Kanamaru
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip-chip type semiconductor device
- Patent number 6,794,058
- Issue date Sep 21, 2004
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition and semiconductor device
- Patent number 6,733,902
- Issue date May 11, 2004
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicone-modified epoxy or phenolic resin compositions and semicond...
- Patent number 6,709,753
- Issue date Mar 23, 2004
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Light-transmissive epoxy resin composition and semiconductor device
- Patent number 6,627,328
- Issue date Sep 30, 2003
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Kanamaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMIC...
- Publication number 20170158926
- Publication date Jun 8, 2017
- Shin-Etsu Chemical Co., Ltd.
- Koichi TSUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTROCONDUCTIVE LIQUID RESIN COMPOSITION AND AN ELECTRONIC PART
- Publication number 20130175485
- Publication date Jul 11, 2013
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya KANAMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, DIE ATTACH METHOD USING SAME, AND SEMICOND...
- Publication number 20120193817
- Publication date Aug 2, 2012
- SHIN-ETSU CHEMICAL CO., LTD.
- Tatsuya KANAMARU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition suitable to be applied by screen printing
- Publication number 20080308225
- Publication date Dec 18, 2008
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Kanamaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Flip-chip type semiconductor device
- Publication number 20030144382
- Publication date Jul 31, 2003
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid epoxy resin composition and semiconductor device
- Publication number 20030069349
- Publication date Apr 10, 2003
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Silicone-modified epoxy or phenolic resin compositions and semicond...
- Publication number 20020192477
- Publication date Dec 19, 2002
- Tsuyoshi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-transmissive epoxy resin composition and flip-chip type semic...
- Publication number 20020058742
- Publication date May 16, 2002
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Light-transmissive epoxy resin composition and semiconductor device
- Publication number 20020058145
- Publication date May 16, 2002
- Tatsuya Kanamaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Tatsuya Kanamaru

Person

Patents Grantslast 30 patents

Epoxy resin composition, die attach method using same, and semicond...

Adhesive composition suitable to be applied by screen printing

Flip-chip type semiconductor device

Liquid epoxy resin composition and semiconductor device

Silicone-modified epoxy or phenolic resin compositions and semicond...

Light-transmissive epoxy resin composition and semiconductor device

Patents Applicationslast 30 patents

LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMIC...

ELECTROCONDUCTIVE LIQUID RESIN COMPOSITION AND AN ELECTRONIC PART

EPOXY RESIN COMPOSITION, DIE ATTACH METHOD USING SAME, AND SEMICOND...

Adhesive composition suitable to be applied by screen printing

Flip-chip type semiconductor device

Liquid epoxy resin composition and semiconductor device

Silicone-modified epoxy or phenolic resin compositions and semicond...

Light-transmissive epoxy resin composition and flip-chip type semic...

Light-transmissive epoxy resin composition and semiconductor device