Tatsuya Shigemura

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Hitachinaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 6,410,978
- Issue date Jun 25, 2002
- Hitachi, Ltd.
- Akio Yasukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and apparatus and semiconductor device
- Patent number 6,271,601
- Issue date Aug 7, 2001
- Hitachi, Ltd.
- Noriaki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module employing metal based molded case and sc...
- Patent number 5,920,119
- Issue date Jul 6, 1999
- Hitachi, Ltd.
- Akihiro Tamba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power semiconductor module
- Publication number 20020153532
- Publication date Oct 24, 2002
- Yukio Sonobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20020050403
- Publication date May 2, 2002
- AKIO YASUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method and apparatus, and semiconductor device
- Publication number 20010042925
- Publication date Nov 22, 2001
- Noriaki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor module
- Publication number 20010038143
- Publication date Nov 8, 2001
- Yukio Sonobe
- H01 - BASIC ELECTRIC ELEMENTS