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Tatsuya Sudo
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Ageoshi, JP
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last 30 patents
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Patent Grant
Copper foil for printed circuit boards
Patent number
6,322,904
Issue date
Nov 27, 2001
Mitsui Mining & Smelting Co., Ltd.
Makoto Dobashi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...