Tatsuya Watanabe

Person

Anjo-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pressure sensor with water restriction plate
- Patent number 8,276,455
- Issue date Oct 2, 2012
- Denso Corporation
- Tatsuya Watanabe
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Metal wiring plate
- Patent number 8,053,685
- Issue date Nov 8, 2011
- Denso Corportion
- Tatsuya Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for detecting resin leak
- Patent number 7,905,131
- Issue date Mar 15, 2011
- Denso Corporation
- Tatsuya Watanabe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing electronic device having resin-molded case...
- Patent number 7,776,247
- Issue date Aug 17, 2010
- Denso Corporation
- Tatsuya Watanabe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Physical quantity sensor and semiconductor device having package an...
- Patent number 7,719,006
- Issue date May 18, 2010
- Denso Corporation
- Tatsuya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin mold and method for manufacturing the same
- Patent number 7,527,760
- Issue date May 5, 2009
- Denso Corporation
- Tatsuya Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Sensor apparatus and sensor apparatus attachment structure
- Publication number 20100223995
- Publication date Sep 9, 2010
- DENSO CORPORATION
- Tatsuya Watanabe
- B60 - VEHICLES IN GENERAL
Information Patent Application
Pressure sensor
- Publication number 20090038399
- Publication date Feb 12, 2009
- DENSO CORPORATION
- Tatsuya Watanabe
- B60 - VEHICLES IN GENERAL
Information Patent Application
Apparatus and method for detecting resin leak
- Publication number 20080314121
- Publication date Dec 25, 2008
- DENSO CORPORATION
- Tatsuya Watanabe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of manufacturing electronic device having resin-molded case...
- Publication number 20080296796
- Publication date Dec 4, 2008
- DENSO CORPORATION
- Tatsuya Watanabe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Electronic device having molded resin case, and molding tool and me...
- Publication number 20080287008
- Publication date Nov 20, 2008
- DENSO CORPORATION
- Tatsuya Watanabe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Metal wiring plate
- Publication number 20080264683
- Publication date Oct 30, 2008
- DENSO CORPORATION
- Tatsuya Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Sensor apparatus
- Publication number 20080236307
- Publication date Oct 2, 2008
- DENSO CORPORATION
- Tatsuya Watanabe
- G01 - MEASURING TESTING
Information Patent Application
Physical quantity sensor and semiconductor device having package an...
- Publication number 20080224304
- Publication date Sep 18, 2008
- DENSO CORPORATION
- Tatsuya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin mold and method for manufacturing the same
- Publication number 20050079360
- Publication date Apr 14, 2005
- DENSO Corporation
- Tatsuya Watanabe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin mold and method for manufacturing the same
- Publication number 20050077656
- Publication date Apr 14, 2005
- DENSO Corporation
- Tatsuya Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Tatsuya Watanabe

Person

Patents Grantslast 30 patents

Pressure sensor with water restriction plate

Metal wiring plate

Apparatus and method for detecting resin leak

Method of manufacturing electronic device having resin-molded case...

Physical quantity sensor and semiconductor device having package an...

Resin mold and method for manufacturing the same

Patents Applicationslast 30 patents

Sensor apparatus and sensor apparatus attachment structure

Pressure sensor

Apparatus and method for detecting resin leak

Method of manufacturing electronic device having resin-molded case...

Electronic device having molded resin case, and molding tool and me...

Metal wiring plate

Sensor apparatus

Physical quantity sensor and semiconductor device having package an...

Resin mold and method for manufacturing the same

Resin mold and method for manufacturing the same