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Tatsuyuki Ohkubo
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Nakakoma-gun, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of bonding inner leads to chip pads
Patent number
6,898,848
Issue date
May 31, 2005
Renesas Technology Corp.
Tatsuyuki Ohkubo
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Semiconductor integrated circuit
Patent number
6,516,515
Issue date
Feb 11, 2003
Hitachi, Ltd.
Tatsuyuki Ohkubo
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Lead bonding machine for bonding leads of a chip disposed over a ca...
Patent number
6,279,226
Issue date
Aug 28, 2001
Hitachi, Ltd.
Tatsuyuki Ohkubo
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor integrated circuit manufacturing method and bonding m...
Publication number
20030084563
Publication date
May 8, 2003
Hitachi, Ltd.
Tatsuyuki Ohkubo
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Semiconductor integrated circuit manufacturing method and bonding m...
Publication number
20010027606
Publication date
Oct 11, 2001
Hitachi, Ltd.
Tatsuyuki Ohkubo
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL