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Tatsuyuki OKUBO

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  • Kumagaya, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Die bonder and bonding method
    • Patent number 8,460,491
    • Issue date Jun 11, 2013
    • Hitachi High-Tech Instruments Co., Ltd.
    • Shingo Fukasawa
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents