TATSUYUKI SUNADA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Ball forming device, wire-bonding apparatus, and ball formation method
- Patent number 10,410,992
- Issue date Sep 10, 2019
- Shinkawa Ltd.
- Yoshihito Hagiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BALL FORMING DEVICE, WIRE-BONDING APPARATUS, AND BALL FORMATION METHOD
- Publication number 20160351538
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- YOSHIHITO HAGIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR