Tauman T Lau

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Extended HBM offsets in 2.5D interposers
- Patent number 11,538,790
- Issue date Dec 27, 2022
- BROADCOM INTERNATIONAL PTE. LTD.
- Mohamed Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate probe and bond regions of an integrated circuit
- Patent number 8,115,321
- Issue date Feb 14, 2012
- LSI Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of power ring positioning to minimize crosstalk
- Patent number 7,863,716
- Issue date Jan 4, 2011
- LSI Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power configuration method for structured ASICs
- Patent number 7,737,564
- Issue date Jun 15, 2010
- LSI Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of power ring positioning to minimize crosstalk
- Patent number 7,569,472
- Issue date Aug 4, 2009
- LSI Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cell-based method for creating slotted metal in semiconductor designs
- Patent number 7,328,417
- Issue date Feb 5, 2008
- LSI Logic Corporation
- Anwar Ali
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Test structure for detecting bonding-induced cracks
- Patent number 6,998,638
- Issue date Feb 14, 2006
- LSI Logic Corporation
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric stack
- Patent number 6,963,138
- Issue date Nov 8, 2005
- LSI Logic Corporation
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit design for both input output limited and core li...
- Patent number 6,836,026
- Issue date Dec 28, 2004
- LSI Logic Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having adaptable core and input/output regions w...
- Patent number 6,798,069
- Issue date Sep 28, 2004
- LSI Logic Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laterally interconnecting structures
- Patent number 6,784,102
- Issue date Aug 31, 2004
- LSI Logic Corporation
- Max M. Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure for detecting bonding-induced cracks
- Patent number 6,781,150
- Issue date Aug 24, 2004
- LSI Logic Corporation
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit component placement
- Patent number 6,768,142
- Issue date Jul 27, 2004
- LSI Logic Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact ring architecture
- Patent number 6,683,476
- Issue date Jan 27, 2004
- LSI Logic Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EXTENDED HBM OFFSETS IN 2.5D INTERPOSERS
- Publication number 20220302080
- Publication date Sep 22, 2022
- Broadcom International Pte. Ltd.
- Mohamed Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE REUSE IN ELECTRICAL CIRCUITS
- Publication number 20140312475
- Publication date Oct 23, 2014
- LSI Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATE PROBE AND BOND REGIONS OF AN INTEGRATED CIRCUIT
- Publication number 20100276816
- Publication date Nov 4, 2010
- ANWAR ALI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS OF POWER RING POSITIONING TO MINIMIZE CROSSTALK
- Publication number 20090321897
- Publication date Dec 31, 2009
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus of power ring positioning to minimize crosstalk
- Publication number 20080099905
- Publication date May 1, 2008
- LSI Logic Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power configuration method for structured ASICs
- Publication number 20070164451
- Publication date Jul 19, 2007
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cell-based method for creating slotted metal in semiconductor designs
- Publication number 20050125759
- Publication date Jun 9, 2005
- Anwar Ali
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Test structure for detecting bonding-induced cracks
- Publication number 20040217487
- Publication date Nov 4, 2004
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric stack
- Publication number 20040150069
- Publication date Aug 5, 2004
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laterally interconnecting structures
- Publication number 20040072421
- Publication date Apr 15, 2004
- Max M. Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test structure
- Publication number 20040043656
- Publication date Mar 4, 2004
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact ring architecture
- Publication number 20030210076
- Publication date Nov 13, 2003
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit component placement
- Publication number 20030209731
- Publication date Nov 13, 2003
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS

Tauman T Lau

Person

Patents Grantslast 30 patents

Extended HBM offsets in 2.5D interposers

Separate probe and bond regions of an integrated circuit

Method and apparatus of power ring positioning to minimize crosstalk

Power configuration method for structured ASICs

Method and apparatus of power ring positioning to minimize crosstalk

Cell-based method for creating slotted metal in semiconductor designs

Test structure for detecting bonding-induced cracks

Dielectric stack

Integrated circuit design for both input output limited and core li...

Integrated circuit having adaptable core and input/output regions w...

Laterally interconnecting structures

Test structure for detecting bonding-induced cracks

Circuit component placement

Contact ring architecture

Patents Applicationslast 30 patents

EXTENDED HBM OFFSETS IN 2.5D INTERPOSERS

DIE REUSE IN ELECTRICAL CIRCUITS

SEPARATE PROBE AND BOND REGIONS OF AN INTEGRATED CIRCUIT

METHOD AND APPARATUS OF POWER RING POSITIONING TO MINIMIZE CROSSTALK

Method and apparatus of power ring positioning to minimize crosstalk

Power configuration method for structured ASICs

Cell-based method for creating slotted metal in semiconductor designs

Test structure for detecting bonding-induced cracks

Dielectric stack

Laterally interconnecting structures

Test structure

Contact ring architecture

Circuit component placement