Taw Ming Lau

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system for chip on lead
- Patent number 7,701,042
- Issue date Apr 20, 2010
- Stats Chippac Ltd.
- Shao Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR CHIP ON LEAD
- Publication number 20080073781
- Publication date Mar 27, 2008
- Shao Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS