Te-Chien Hou

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
CMP system and method of use
- Patent number 11,984,323
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Grant
CMP polishing head design for improving removal rate uniformity
- Patent number 11,865,666
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Grant
CMP polishing head design for improving removal rate uniformity
- Patent number 11,529,712
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Grant
Method for conditioning polishing pad
- Patent number 11,389,928
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Nan Lee
- B24 - GRINDING POLISHING
Information Patent Grant
CMP system and method of use
- Patent number 11,069,533
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chien Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP polishing head design for improving removal rate uniformity
- Patent number 10,160,091
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
- Publication number 20240420978
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICA...
- Publication number 20240412977
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING TOOL AND METHOD
- Publication number 20240395537
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-hsiang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING TOOL AND METHOD
- Publication number 20240383092
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383093
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240363447
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING TH...
- Publication number 20240359287
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
CMP System and Method of Use
- Publication number 20240274440
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20230405756
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad for Chemical Mechanical Polishing and Method
- Publication number 20230398659
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, CONTROL METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20230390882
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
CMP Polishing Head Design for Improving Removal Rate Uniformity
- Publication number 20230125195
- Publication date Apr 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL PLANARIZATION PAD AND METHODS OF USE
- Publication number 20230021149
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICA...
- Publication number 20220415665
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONDITIONING POLISHING PAD
- Publication number 20220362906
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Nan LEE
- B24 - GRINDING POLISHING
Information Patent Application
CMP System and Method of Use
- Publication number 20210343538
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
CMP System and Method of Use
- Publication number 20210020449
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONDITIONING POLISHING PAD
- Publication number 20190160628
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Nan LEE
- B24 - GRINDING POLISHING
Information Patent Application
CMP Polishing Head Design for Improving Removal Rate Uniformity
- Publication number 20190126429
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
CMP Polishing Head Design for Improving Removal Rate Uniformity
- Publication number 20170136602
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING

Te-Chien Hou

Person

Patents Grantslast 30 patents

CMP system and method of use

CMP polishing head design for improving removal rate uniformity

CMP polishing head design for improving removal rate uniformity

Method for conditioning polishing pad

CMP system and method of use

CMP polishing head design for improving removal rate uniformity

Patents Applicationslast 30 patents

RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING

SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICA...

PROCESSING TOOL AND METHOD

POLISHING TOOL AND METHOD

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING TH...

CMP System and Method of Use

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

Polishing Pad for Chemical Mechanical Polishing and Method

SYSTEM, CONTROL METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING

CMP Polishing Head Design for Improving Removal Rate Uniformity

CHEMICAL-MECHANICAL PLANARIZATION PAD AND METHODS OF USE

SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICA...

METHOD FOR CONDITIONING POLISHING PAD

CMP System and Method of Use

CMP System and Method of Use

METHOD FOR CONDITIONING POLISHING PAD

CMP Polishing Head Design for Improving Removal Rate Uniformity

CMP Polishing Head Design for Improving Removal Rate Uniformity