Te-Hsuan Peng

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,016,173
- Issue date Jun 18, 2024
- Winbond Electronics Corp.
- Te-Hsuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having multi-work f...
- Patent number 11,943,913
- Issue date Mar 26, 2024
- Winbond Electronics Corp.
- Te-Hsuan Peng

Patents Applicationslast 30 patents

Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF
- Publication number 20240334685
- Publication date Oct 3, 2024
- WINBOND ELECTRONICS CORP.
- Te-Hsuan Peng
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURES
- Publication number 20240321628
- Publication date Sep 26, 2024
- WINBOND ELECTRONICS CORP.
- Yu-Po WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240292595
- Publication date Aug 29, 2024
- WINBOND ELECTRONICS CORP.
- Te-Hsuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING MULTI-WORK F...
- Publication number 20230255020
- Publication date Aug 10, 2023
- WINBOND ELECTRONICS CORP.
- Te-Hsuan PENG
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230084548
- Publication date Mar 16, 2023
- WINBOND ELECTRONICS CORP.
- Te-Hsuan PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220068930
- Publication date Mar 3, 2022
- WINBOND ELECTRONICS CORP.
- Te-Hsuan Peng
- H01 - BASIC ELECTRIC ELEMENTS