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Tainan City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Package structure with a barrier layer
Patent number
11,984,419
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,855,007
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Rung-De Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive external connector structure and method of forming
Patent number
11,527,504
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Fu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming package structure with a barrier layer
Patent number
11,469,203
Issue date
Oct 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,348,879
Issue date
May 31, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Rung-De Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor structure
Patent number
10,818,612
Issue date
Oct 27, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Rung-De Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with a barrier layer and method for forming the same
Patent number
10,811,377
Issue date
Oct 20, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive external connector structure and method of forming
Patent number
10,741,513
Issue date
Aug 11, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Fu Shih
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
10,276,514
Issue date
Apr 30, 2019
Taiwan Semiconductor Manufacturing Co., Ltd
Rung-De Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive external connector structure and method of forming
Patent number
10,163,836
Issue date
Dec 25, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Fu Shih
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Conductive external connector structure and method of forming
Patent number
9,875,979
Issue date
Jan 23, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Fu Shih
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
Publication number
20220367398
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20220254737
Publication date
Aug 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Rung-De Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
Publication number
20210035937
Publication date
Feb 4, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20210013159
Publication date
Jan 14, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Rung-De Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive External Connector Structure and Method of Forming
Publication number
20200373267
Publication date
Nov 26, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Meng-Fu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
Publication number
20190371741
Publication date
Dec 5, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Rung-De Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20190189577
Publication date
Jun 20, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20190131251
Publication date
May 2, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Rung-De Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive External Connector Structure and Method of Forming
Publication number
20190131263
Publication date
May 2, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Fu Shih
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Conductive External Connector Structure and Method of Forming
Publication number
20180166409
Publication date
Jun 14, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Fu Shih
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Conductive External Connector Structure and Method of Forming
Publication number
20170141059
Publication date
May 18, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Fu Shih
H01 - BASIC ELECTRIC ELEMENTS