Te-Sheng Yang

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multiple winding transformer
- Patent number 9,972,433
- Issue date May 15, 2018
- Lite-On Technology Corp.
- Te-Hong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant converting apparatus and control method thereof
- Patent number 9,906,142
- Issue date Feb 27, 2018
- Lite-On Electronics (Guangzhou) Limited
- Te-Hong Yang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power supply apparatus
- Patent number 9,729,046
- Issue date Aug 8, 2017
- Lite-On Technology Corp.
- Te-Hong Yang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated circuit packages and the method for making the same
- Patent number 6,846,697
- Issue date Jan 25, 2005
- United Microelectronics Corp.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and the method for the same
- Patent number 6,545,350
- Issue date Apr 8, 2003
- United Microelectronics Corp.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-dies packaging structure and packaging method
- Patent number 6,399,421
- Issue date Jun 4, 2002
- United Microelectronics Corp.
- Charlie Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-dies packaging structure and packaging method
- Patent number 6,313,527
- Issue date Nov 6, 2001
- United Microelectronics Corp.
- Charlie Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual silicon chip package
- Patent number 6,291,881
- Issue date Sep 18, 2001
- United Microelectronics Corp.
- Te-Sheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip scale package
- Patent number 6,204,562
- Issue date Mar 20, 2001
- United Microelectronics Corp.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating wafer-level package
- Patent number 6,043,109
- Issue date Mar 28, 2000
- United Microelectronics Corp.
- Te-Sheng Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESONANT CONVERTING APPARATUS AND CONTROL METHOD THEREOF
- Publication number 20180019679
- Publication date Jan 18, 2018
- LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
- Te-Hong Yang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER SUPPLY APPARATUS
- Publication number 20170229954
- Publication date Aug 10, 2017
- LITE-ON TECHNOLOGY CORP.
- TE-HONG YANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTIPLE WINDING TRANSFORMER
- Publication number 20170062123
- Publication date Mar 2, 2017
- LITE-ON TECHNOLOGY CORP.
- TE-HONG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit packages and the method for the same
- Publication number 20020111008
- Publication date Aug 15, 2002
- United Microelectronics Corp.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit packages and the method for the same
- Publication number 20020102833
- Publication date Aug 1, 2002
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE
- Publication number 20020053450
- Publication date May 9, 2002
- TE-SHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-dies packaging structure and packaging method
- Publication number 20010054761
- Publication date Dec 27, 2001
- Charlie Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN ELECTRICAL STATIC DISCHARGE RESISTOR
- Publication number 20010052632
- Publication date Dec 20, 2001
- TSUNG-CHIH WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME HAVING JOINED INTERNAL LEAD
- Publication number 20010050420
- Publication date Dec 13, 2001
- TE-SHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS

Te-Sheng Yang

Person

Patents Grantslast 30 patents

Multiple winding transformer

Resonant converting apparatus and control method thereof

Power supply apparatus

Integrated circuit packages and the method for making the same

Integrated circuit packages and the method for the same

Dual-dies packaging structure and packaging method

Dual-dies packaging structure and packaging method

Dual silicon chip package

Wafer-level chip scale package

Method of fabricating wafer-level package

Patents Applicationslast 30 patents

RESONANT CONVERTING APPARATUS AND CONTROL METHOD THEREOF

POWER SUPPLY APPARATUS

MULTIPLE WINDING TRANSFORMER

Integrated circuit packages and the method for the same

Integrated circuit packages and the method for the same

WAFER-LEVEL PACKAGE

Dual-dies packaging structure and packaging method

SEMICONDUCTOR PACKAGE WITH AN ELECTRICAL STATIC DISCHARGE RESISTOR

LEADFRAME HAVING JOINED INTERNAL LEAD