Te Yu Lin

Person

Hsinchu Industries District, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible hybrid electronic substrate and electronic textile includi...
- Patent number 12,232,256
- Issue date Feb 18, 2025
- Industrial Technology Research Institute
- I-Hung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit apparatus, manufacturing method thereof and circuit system
- Patent number 11,963,295
- Issue date Apr 16, 2024
- Industrial Technology Research Institute
- Hung-Hsien Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure
- Patent number 11,362,045
- Issue date Jun 14, 2022
- Industrial Technology Research Institute
- Te-Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature light set
- Patent number 5,622,425
- Issue date Apr 22, 1997
- Te H. Lin
- F21 - LIGHTING
Information Patent Grant
Miniature light set
- Patent number 5,339,232
- Issue date Aug 16, 1994
- Te H. Lin
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE HYBRID ELECTRONIC SUBSTRATE AND ELECTRONIC TEXTILE INCLUDI...
- Publication number 20230147556
- Publication date May 11, 2023
- Industrial Technology Research Institute
- I-Hung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT APPARATUS, MANUFACTURING METHOD THEREOF AND CIRCUIT SYSTEM
- Publication number 20230138696
- Publication date May 4, 2023
- Industrial Technology Research Institute
- Hung-Hsien Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT FILM HEATER
- Publication number 20220338309
- Publication date Oct 20, 2022
- Industrial Technology Research Institute
- Li-Wei Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210183789
- Publication date Jun 17, 2021
- Industrial Technology Research Institute
- Te-Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polyimide composite flexible board and its preparation
- Publication number 20080107884
- Publication date May 8, 2008
- Chang Chun Plastics Co., Ltd.
- Kuen Yuan Hwang
- B32 - LAYERED PRODUCTS
Information Patent Application
Polyimide composite flexible board and its preparation
- Publication number 20080107897
- Publication date May 8, 2008
- Chang Chun Plastics Co., Ltd.
- Kuen Yuan Hwang
- B32 - LAYERED PRODUCTS
Information Patent Application
Polyimide composite flexible board and its preparation
- Publication number 20080070016
- Publication date Mar 20, 2008
- Chang Chun Plastics Co., Ltd.
- Kuen Yuan Hwang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Polyimide composite flexible board and its preparation field of the...
- Publication number 20080026195
- Publication date Jan 31, 2008
- Chang Chun Plastics Co., Ltd.
- Kuen Yuan Hwang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
New process for preparing polyimide
- Publication number 20060105185
- Publication date May 18, 2006
- Chang Chun Plastics Co., Ltd.
- Kuen Yuan Hwang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Person

Patents Grantslast 30 patents

Flexible hybrid electronic substrate and electronic textile includi...

Circuit apparatus, manufacturing method thereof and circuit system

Chip package structure

Miniature light set

Miniature light set

Patents Applicationslast 30 patents

FLEXIBLE HYBRID ELECTRONIC SUBSTRATE AND ELECTRONIC TEXTILE INCLUDI...

CIRCUIT APPARATUS, MANUFACTURING METHOD THEREOF AND CIRCUIT SYSTEM

TRANSPARENT FILM HEATER

CHIP PACKAGE STRUCTURE

Polyimide composite flexible board and its preparation

Polyimide composite flexible board and its preparation

Polyimide composite flexible board and its preparation

Polyimide composite flexible board and its preparation field of the...

New process for preparing polyimide