Teak-Hoon Lee

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,165,991
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,074,141
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Seung Hun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,923,343
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,848,293
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Sunkyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,594,499
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,538,792
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having recessed adhesive layer between stacke...
- Patent number 10,930,613
- Issue date Feb 23, 2021
- Samsung Electronics Co., Ltd.
- Sang Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,721,930
- Issue date Aug 1, 2017
- Samsung Electronics Co., Ltd.
- Hyoungjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having TSV and adhesive layer
- Patent number 9,159,651
- Issue date Oct 13, 2015
- Samsung Electronics Co., Ltd.
- Teak-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-stacked semiconductor package
- Patent number 9,136,260
- Issue date Sep 15, 2015
- Samsung Electronics Co., Ltd.
- Jung-seok Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate of semiconductor package and method of fabricating semico...
- Patent number 9,082,871
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Gi-Jun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate of semiconductor package and method of fabricating semico...
- Patent number 8,987,904
- Issue date Mar 24, 2015
- Samsung Electronics Co., Ltd.
- Gi-Jun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having buried post in encapsulant and method...
- Patent number 8,846,446
- Issue date Sep 30, 2014
- Samsung Electronics Co., Ltd.
- Pyoung-Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-stacked semiconductor package
- Patent number 8,637,350
- Issue date Jan 28, 2014
- Samsung Electronics Co., Ltd.
- Jung-seok Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chips in a semiconductor package
- Patent number 8,637,969
- Issue date Jan 28, 2014
- Samsung Electronics Co., Ltd.
- Teak-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating stacked chips in a semiconductor package
- Patent number 8,455,301
- Issue date Jun 4, 2013
- Samsung Electronics Co., Ltd.
- Teak-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and electronic device having the same
- Patent number 8,344,497
- Issue date Jan 1, 2013
- Samsung Electronics Co., Ltd.
- Pyoung-Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing the semiconducto...
- Patent number 8,154,122
- Issue date Apr 10, 2012
- Samsung Electronics Co., Ltd.
- Chul-Yong Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having buried post in encapsulant and method...
- Patent number 8,093,703
- Issue date Jan 10, 2012
- Samsung Electronics Co., Ltd.
- Pyoung-Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package, electronic device including the semicon...
- Patent number 8,008,771
- Issue date Aug 30, 2011
- Samsung Electronics Co., Ltd.
- Pyoung-Wan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of fabricating the same
- Patent number 7,807,512
- Issue date Oct 5, 2010
- Samsung Electronics Co., Ltd.
- Teak-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379626
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Seung Hun SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240162194
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088075
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178499
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230088032
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220293565
- Publication date Sep 15, 2022
- Samsung Electronics Co., Ltd.
- Seung Hun SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INCREASED THERMAL RADIATION EFFICIENCY
- Publication number 20220293566
- Publication date Sep 15, 2022
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220093543
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220020701
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210366876
- Publication date Nov 25, 2021
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200098719
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- Sang Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170005075
- Publication date Jan 5, 2017
- Samsung Electronics Co., Ltd.
- Hyoungjoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICO...
- Publication number 20150155259
- Publication date Jun 4, 2015
- Samsung Electronics Co., Ltd.
- Gi-Jun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING TSV AND ADHESIVE LAYER
- Publication number 20140291854
- Publication date Oct 2, 2014
- Samsung Electronics Co., Ltd.
- Teak-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE
- Publication number 20140154839
- Publication date Jun 5, 2014
- Jung-seok Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICO...
- Publication number 20140008794
- Publication date Jan 9, 2014
- Samsung Electronics Co., Ltd.
- Gi-Jun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20130264706
- Publication date Oct 10, 2013
- Teak-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSE...
- Publication number 20130149817
- Publication date Jun 13, 2013
- Samsung Electronics Co., Ltd.
- Chang-Seong JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130032947
- Publication date Feb 7, 2013
- Sang-sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE
- Publication number 20120282735
- Publication date Nov 8, 2012
- Jung-seok Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20120088332
- Publication date Apr 12, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Teak-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STACK PACKAGE
- Publication number 20120077314
- Publication date Mar 29, 2012
- Samsung Electronics Co., Ltd.
- Sang-sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING BURIED POST IN ENCAPSULANT AND METHOD...
- Publication number 20120077311
- Publication date Mar 29, 2012
- Pyoung-Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20100013076
- Publication date Jan 21, 2010
- Samsung Electronics., Co., Ltd.
- Chul-Yong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAF...
- Publication number 20090298234
- Publication date Dec 3, 2009
- Teak-hoon Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SEMICONDUCTO...
- Publication number 20090289359
- Publication date Nov 26, 2009
- Samsung Electronics Co., Ltd.
- Chul-Yong Jang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor packages and methods of fabricating the same
- Publication number 20090239336
- Publication date Sep 24, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Teak-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...
- Publication number 20090134528
- Publication date May 28, 2009
- Samsung Electronics Co, Ltd.
- Teak-Hoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20090096071
- Publication date Apr 16, 2009
- Samsung Electronics Co., Ltd.
- Pyoung-Wan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING RESIN SUBSTRATE WITH RECESS AND METHOD...
- Publication number 20090065919
- Publication date Mar 12, 2009
- Samsung Electronics Co., Ltd.
- Chul-Yong Jang
- H01 - BASIC ELECTRIC ELEMENTS

Teak-Hoon Lee

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package having recessed adhesive layer between stacke...

Semiconductor package and method for fabricating the same

Semiconductor packages having TSV and adhesive layer

Method of manufacturing chip-stacked semiconductor package

Substrate of semiconductor package and method of fabricating semico...

Substrate of semiconductor package and method of fabricating semico...

Semiconductor package having buried post in encapsulant and method...

Method of manufacturing chip-stacked semiconductor package

Stacked chips in a semiconductor package

Method of fabricating stacked chips in a semiconductor package

Semiconductor package and electronic device having the same

Semiconductor package and methods of manufacturing the semiconducto...

Semiconductor package having buried post in encapsulant and method...

Semiconductor chip package, electronic device including the semicon...

Semiconductor packages and methods of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH INCREASED THERMAL RADIATION EFFICIENCY

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICO...

SEMICONDUCTOR PACKAGES HAVING TSV AND ADHESIVE LAYER

METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE

SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICO...

Semiconductor Package and Method of Manufacturing the Same

FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE

Semiconductor Package and Method of Manufacturing the Same

METHOD OF FABRICATING SEMICONDUCTOR STACK PACKAGE

SEMICONDUCTOR PACKAGE HAVING BURIED POST IN ENCAPSULANT AND METHOD...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAF...

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SEMICONDUCTO...

Semiconductor packages and methods of fabricating the same

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME

SEMICONDUCTOR PACKAGE HAVING RESIN SUBSTRATE WITH RECESS AND METHOD...