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Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus
- Patent number 9,698,117
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Yongdae Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insert for semiconductor package and testing apparatus with the same
- Patent number 9,024,649
- Issue date May 5, 2015
- Samsung Electronics Co., Ltd.
- Guiheum Choi
- G01 - MEASURING TESTING
Information Patent Grant
Test socket having a housing with clamping devices to connect the h...
- Patent number 8,939,784
- Issue date Jan 27, 2015
- Samsung Electronics Co., Ltd.
- Sangki Lee
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING APPARATUS
- Publication number 20150228612
- Publication date Aug 13, 2015
- Samsung Electronics Co., Ltd.
- Yongdae HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE TEST SOCKETS
- Publication number 20130260592
- Publication date Oct 3, 2013
- Samsung Electronics Co., LTD
- Sangki LEE
- G01 - MEASURING TESTING
Information Patent Application
INSERT FOR SEMICONDUCTOR PACAKGE AND TESTING APPARATUS WITH THE SAME
- Publication number 20130127484
- Publication date May 23, 2013
- Samsung Electronics Co., Ltd.
- Guiheum Choi
- G01 - MEASURING TESTING