Techun Wang

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Taipei City, TW

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Patents Applicationslast 30 patents

Information Patent Application
MICRO-LAYER CMP POLISHING SUBPAD
- Publication number 20240181596
- Publication date Jun 6, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Guanhua Hou
- B24 - GRINDING POLISHING
Information Patent Application
DUAL-LAYER CMP POLISHING SUBPAD
- Publication number 20240181597
- Publication date Jun 6, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Guanhua Hou
- B24 - GRINDING POLISHING