Teck Beng Lau

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Petaling Jaya, MY

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Patents Grantslast 30 patents

Information Patent Grant
Flexible packaged integrated circuit
- Patent number 9,287,236
- Issue date Mar 15, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die sensor device
- Patent number 9,190,352
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kong Bee Tiu
- G01 - MEASURING TESTING
Information Patent Grant
Side vented pressure sensor device
- Patent number 9,040,335
- Issue date May 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Low Boon Yew
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solar powered IC chip
- Patent number 8,809,078
- Issue date Aug 19, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar powered IC chip
- Patent number 8,778,704
- Issue date Jul 15, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of testing same
- Patent number 8,338,828
- Issue date Dec 25, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE PACKAGED INTEGRATED CIRCUIT
- Publication number 20160020189
- Publication date Jan 21, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SENSOR DEVICE
- Publication number 20150137279
- Publication date May 21, 2015
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CORNER TOP GATE MOLDING
- Publication number 20150118802
- Publication date Apr 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SOLAR POWERED IC CHIP
- Publication number 20140225211
- Publication date Aug 14, 2014
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING SAME
- Publication number 20120032167
- Publication date Feb 9, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew LOW
- H01 - BASIC ELECTRIC ELEMENTS