Teck-Chong Lee

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure
- Patent number 12,176,259
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,166,009
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,894,317
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-Hsien Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with interposer encapsulated by an encapsulant
- Patent number 11,887,928
- Issue date Jan 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,855,034
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device and electronic device
- Patent number 11,764,311
- Issue date Sep 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,742,324
- Issue date Aug 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages including an inductor and a capacitor
- Patent number 11,637,172
- Issue date Apr 25, 2023
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure and method for manufacturing the same
- Patent number 11,621,220
- Issue date Apr 4, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,605,877
- Issue date Mar 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Sheng-Chi Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor bank structure and semiconductor package structure
- Patent number 11,545,427
- Issue date Jan 3, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,515,241
- Issue date Nov 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,508,655
- Issue date Nov 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,495,572
- Issue date Nov 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for packaging the same
- Patent number 11,373,967
- Issue date Jun 28, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,276,620
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device and method of manufacturing the same
- Patent number 11,133,423
- Issue date Sep 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,011,496
- Issue date May 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,950,531
- Issue date Mar 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,903,561
- Issue date Jan 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive component and method for manufacturing the same
- Patent number 10,861,840
- Issue date Dec 8, 2020
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages including an inductor and a capacitor
- Patent number 10,833,144
- Issue date Nov 10, 2020
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,741,523
- Issue date Aug 11, 2020
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device
- Patent number 10,490,341
- Issue date Nov 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a dielectric layer with bui...
- Patent number 10,475,718
- Issue date Nov 12, 2019
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process of making the same
- Patent number 9,929,132
- Issue date Mar 27, 2018
- Advanced Semiconductor Engineering, Inc.
- Teck-Chong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,881,917
- Issue date Jan 30, 2018
- Advanced Semiconductor Engineering, Inc.
- Hsu-Chiang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,837,352
- Issue date Dec 5, 2017
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process of making the same
- Patent number 9,577,027
- Issue date Feb 21, 2017
- Advanced Semiconductor Engineering, Inc.
- Teck-Chong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with passive element network and manufactur...
- Patent number 8,853,819
- Issue date Oct 7, 2014
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178158
- Publication date May 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-Hsien KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH INTERPOSER ENCAPSULATED BY AN ENCAPSULANT
- Publication number 20240170396
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230411349
- Publication date Dec 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING AN INDUCTOR AND A CAPACITOR
- Publication number 20230261036
- Publication date Aug 17, 2023
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230197600
- Publication date Jun 22, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230178444
- Publication date Jun 8, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230092252
- Publication date Mar 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384381
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220310500
- Publication date Sep 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220068839
- Publication date Mar 3, 2022
- Advanced Semiconductor Engineering, Inc.
- Po-Hsien KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220020885
- Publication date Jan 20, 2022
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210288024
- Publication date Sep 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210210420
- Publication date Jul 8, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210210423
- Publication date Jul 8, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210202336
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR PACKAGING THE SAME
- Publication number 20210151398
- Publication date May 20, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210074676
- Publication date Mar 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING AN INDUCTOR AND A CAPACITOR
- Publication number 20210043719
- Publication date Feb 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210005761
- Publication date Jan 7, 2021
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200381348
- Publication date Dec 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200381345
- Publication date Dec 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200350282
- Publication date Nov 5, 2020
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200335858
- Publication date Oct 22, 2020
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200118970
- Publication date Apr 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200083591
- Publication date Mar 12, 2020
- Advanced Semiconductor Engineering, Inc.
- Sheng-Chi HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200075571
- Publication date Mar 5, 2020
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR BANK STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHO...
- Publication number 20190393297
- Publication date Dec 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190067261
- Publication date Feb 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE
- Publication number 20190057809
- Publication date Feb 21, 2019
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20180337164
- Publication date Nov 22, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Teck-Chong Lee

Person

Patents Grantslast 30 patents

Semiconductor package structure

Semiconductor device packages and methods of manufacturing the same

Package structure and method for manufacturing the same

Package structure with interposer encapsulated by an encapsulant

Electronic device package and method of manufacturing the same

Optical device and electronic device

Semiconductor device packages and methods of manufacturing the same

Semiconductor device packages including an inductor and a capacitor

Assembly structure and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Capacitor bank structure and semiconductor package structure

Semiconductor device package and method of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor device package and method for packaging the same

Package structure and method for manufacturing the same

Optical device and method of manufacturing the same

Semiconductor device packages and methods of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Integrated passive component and method for manufacturing the same

Semiconductor device packages including an inductor and a capacitor

Semiconductor package device and method of manufacturing the same

Electrical device

Semiconductor device package comprising a dielectric layer with bui...

Semiconductor device and process of making the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and process of making the same

Semiconductor structure with passive element network and manufactur...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE WITH INTERPOSER ENCAPSULATED BY AN ENCAPSULANT

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES INCLUDING AN INDUCTOR AND A CAPACITOR

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR PACKAGING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES INCLUDING AN INDUCTOR AND A CAPACITOR

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

CAPACITOR BANK STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHO...

INTEGRATED PASSIVE COMPONENT AND METHOD FOR MANUFACTURING THE SAME

ELECTRICAL DEVICE

SEMICONDUCTOR DEVICE PACKAGE