Teck Siang Tan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
System and application server for secure guest checkout
- Patent number 12,093,917
- Issue date Sep 17, 2024
- MASTERCARD ASIA/PACIFIC PTE. LTD.
- Zunhua Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus, transfer method, chamber and frame for semiconductor bur...
- Patent number 11,982,706
- Issue date May 14, 2024
- MSV SYSTEMS & SERVICES PTE LTD
- Teck Huat Tan
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for securely initiating a checkout with an enroll...
- Patent number 11,948,141
- Issue date Apr 2, 2024
- MASTERCARD ASIA/PACIFIC PTE. LTD.
- Srinath Ravinathan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Additive manufacturing device with release mechanism
- Patent number 10,882,247
- Issue date Jan 5, 2021
- STRUCTO PTE LTD
- Hubertus Theodorus Petrus Van Esbroeck
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Systems, methods, and software for presenting parameter set(s) for...
- Patent number 10,860,183
- Issue date Dec 8, 2020
- Rockwell Automation Asia Pacific
- Scott Peter Miles
- G05 - CONTROLLING REGULATING
Information Patent Grant
Systems, methods, and software for presenting parameter set(s) for...
- Patent number 10,254,926
- Issue date Apr 9, 2019
- Rockwell Automation Asia Pacific
- Scott Peter Miles
- G05 - CONTROLLING REGULATING
Information Patent Grant
Enhanced wake activation response speeds for industrial control sys...
- Patent number 10,185,297
- Issue date Jan 22, 2019
- Rockwell Automation Technologies, Inc.
- Teck Siang Tan
- G05 - CONTROLLING REGULATING
Information Patent Grant
Programmable control module for an industrial device
- Patent number 9,880,539
- Issue date Jan 30, 2018
- Rockwell Automation Asia Pacific Business Center Pte. Ltd.
- Scott P. Miles
- G05 - CONTROLLING REGULATING
Information Patent Grant
Modular motor drive communication system and method
- Patent number 9,722,526
- Issue date Aug 1, 2017
- Rockwell Automation Technologies, Inc.
- James B. Vitrano
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 9,627,338
- Issue date Apr 18, 2017
- STATS ChipPAC Pte. Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible routing for chip on board applications
- Patent number 9,287,189
- Issue date Mar 15, 2016
- Broadcom Corporation
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package technology for fan-out wafer-level packaging
- Patent number 8,643,164
- Issue date Feb 4, 2014
- Broadcom Corporation
- Matthew Vernon Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly reliable low cost structure for wafer-level ball grid array...
- Patent number 7,834,449
- Issue date Nov 16, 2010
- Broadcom Corporation
- Matthew V. Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with light-blocking features
- Patent number 7,294,827
- Issue date Nov 13, 2007
- Delphi Technologies, Inc.
- Teck Tiong Tan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Media stack status indicator
- Patent number 6,206,362
- Issue date Mar 27, 2001
- Hewlett-Packard Company
- Teck Cheng Tan
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
CROSS-PLATFORM RECORD MANAGEMENT USING A PEER-TO-PEER LINK SERVICE
- Publication number 20240354751
- Publication date Oct 24, 2024
- MasterCard Asia/Pacific Pte. Ltd.
- Teck Yong TAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR BURN-IN BOARD ALIGNMENT AND SEALING BETWEE...
- Publication number 20240053397
- Publication date Feb 15, 2024
- MSV SYSTEMS & SERVICES PTE LTD
- Teck Huat TAN
- G01 - MEASURING TESTING
Information Patent Application
CONNECTED OXYGEN THERAPY SYSTEM FOR MAINTAINING PATIENT ENGAGEMENT...
- Publication number 20230330378
- Publication date Oct 19, 2023
- ResMed Asia Pte. Ltd.
- Alexia Judith Claudine PERES
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CONNECTED OXYGEN THERAPY SYSTEM FOR CHRONIC RESPIRATORY DISEASE MAN...
- Publication number 20230270967
- Publication date Aug 31, 2023
- ResMed Asia Pte. Ltd.
- Wai Loon OOI
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
APPARATUS, TRANSFER METHOD, CHAMBER AND FRAME FOR SEMICONDUCTOR BUR...
- Publication number 20230251305
- Publication date Aug 10, 2023
- MSV SYSTEMS & SERVICES PTE LTD
- Teck Huat TAN
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR PROVIDING CONCENTRATED THERAPY GAS FOR A...
- Publication number 20230149655
- Publication date May 18, 2023
- ResMed Asia Pte. Ltd.
- Stephen YUEN
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SMART CHIP PAYMENT ACCEPTANCE
- Publication number 20230153807
- Publication date May 18, 2023
- MasterCard Asia/Pacific Pte. Ltd.
- Weiming MA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER MANAGEMENT IN PORTABLE OXYGEN CONCENTRATORS
- Publication number 20230112963
- Publication date Apr 13, 2023
- ResMed Asia Pte. Ltd.
- Stephen YUEN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD AND SYSTEM FOR USE OF AN EMV CARD IN A MULTI-SIGNATURE WALLE...
- Publication number 20210312431
- Publication date Oct 7, 2021
- MasterCard Asia/Pacific Pte. Ltd.
- Srinath RAVINATHAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADDITIVE MANUFACTURING DEVICE WITH RELEASE MECHANISM
- Publication number 20210122105
- Publication date Apr 29, 2021
- Structo Pte Ltd
- Hubertus Theodorus Petrus VAN ESBROECK
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD AND SYSTEM FOR SECURELY INITIATING A CHECKOUT WITH AN ENROLL...
- Publication number 20210097525
- Publication date Apr 1, 2021
- MasterCard Asia/Pacific Pte. Ltd.
- Srinath Ravinathan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND APPLICATION SERVER FOR SECURE GUEST CHECKOUT
- Publication number 20210065153
- Publication date Mar 4, 2021
- MasterCard Asia/Pacific Pte. Ltd.
- Zunhua Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR CONDUCTING A TRANSANCTION
- Publication number 20190251539
- Publication date Aug 15, 2019
- MasterCard Asia/Pacific Pte. Ltd.
- Bensam Joyson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS, METHODS, AND SOFTWARE FOR PRESENTING PARAMETER SET(S) FOR...
- Publication number 20190018559
- Publication date Jan 17, 2019
- ROCKWELL AUTOMATION ASIA PACIFIC BUSINESS CTR. PTE., LTD
- Scott Peter Miles
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and System for Facilitating Mobile Payment for Products
- Publication number 20180101838
- Publication date Apr 12, 2018
- MasterCard Asia/Pacific Pte. Ltd.
- Teck Yong Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADDITIVE MANUFACTURING DEVICE WITH RELEASE MECHANISM
- Publication number 20180029296
- Publication date Feb 1, 2018
- Structo Pte Ltd
- Hubertus Theodorus Petrus VAN ESBROECK
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
- Publication number 20170186660
- Publication date Jun 29, 2017
- STATS ChipPAC Pte Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED WAKE ACTIVATION RESPONSE SPEEDS FOR INDUSTRIAL CONTROL SYS...
- Publication number 20160370777
- Publication date Dec 22, 2016
- Rockwell Automation Technologies, Inc.
- Teck Siang Tan
- G05 - CONTROLLING REGULATING
Information Patent Application
Modular Motor Drive Communication System and Method
- Publication number 20150249420
- Publication date Sep 3, 2015
- Rockwell Automation Technologies, Inc.
- James B. Vitrano
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
- Publication number 20140252641
- Publication date Sep 11, 2014
- STATS ChipPAC, Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ROUTING FOR CHIP ON BOARD APPLICATIONS
- Publication number 20140124940
- Publication date May 8, 2014
- BROADCOM CORPORATION
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND SOFTWARE FOR PRESENTING PARAMETER SET(S) FOR...
- Publication number 20140081429
- Publication date Mar 20, 2014
- ROCKWELL AUTOMATION ASIA PACIFIC BUSINESS CTR. PTE., LTD
- Scott Peter Miles
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROGRAMMABLE CONTROL MODULE FOR AN INDUSTRIAL DEVICE
- Publication number 20120221155
- Publication date Aug 30, 2012
- ROCKWELL AUTOMATION ASIA PACIFIC BUSINESS CENTER PTE. LTD.
- Scott P. Miles
- G05 - CONTROLLING REGULATING
Information Patent Application
PACKAGE-ON-PACKAGE TECHNOLOGY FOR FAN-OUT WAFER-LEVEL PACKAGING
- Publication number 20100314739
- Publication date Dec 16, 2010
- BROADCOM CORPORATION
- Matthew Vernon Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Highly Reliable Low Cost Structure for Wafer-Level Ball Grid Array...
- Publication number 20080265408
- Publication date Oct 30, 2008
- BROADCOM CORPORATION
- Matthew V. Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME
- Publication number 20080150107
- Publication date Jun 26, 2008
- ADVANPACK SOLUTION PTES LTD
- Teck Tiong TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE
- Publication number 20070284420
- Publication date Dec 13, 2007
- Advanpack Solutions Pte Ltd
- Teck Tiong Tan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip in package using flexible and removable leadframe
- Publication number 20070196979
- Publication date Aug 23, 2007
- Advanpack Solutions Pte Ltd
- Teck Tiong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical sensor package and method of manufacture
- Publication number 20060180888
- Publication date Aug 17, 2006
- Advanpack Solutions Pte Ltd
- Teck Tiong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sinking structure
- Publication number 20060103016
- Publication date May 18, 2006
- Advanpack Solutions Pte Ltd
- Teck Tiong Tan
- H01 - BASIC ELECTRIC ELEMENTS

Teck Siang Tan

Person

Patents Grantslast 30 patents

System and application server for secure guest checkout

Apparatus, transfer method, chamber and frame for semiconductor bur...

Method and system for securely initiating a checkout with an enroll...

Additive manufacturing device with release mechanism

Systems, methods, and software for presenting parameter set(s) for...

Systems, methods, and software for presenting parameter set(s) for...

Enhanced wake activation response speeds for industrial control sys...

Programmable control module for an industrial device

Modular motor drive communication system and method

Semiconductor device and method of forming ultra high density embed...

Flexible routing for chip on board applications

Package-on-package technology for fan-out wafer-level packaging

Highly reliable low cost structure for wafer-level ball grid array...

Electronic module with light-blocking features

Media stack status indicator

Patents Applicationslast 30 patents

CROSS-PLATFORM RECORD MANAGEMENT USING A PEER-TO-PEER LINK SERVICE

APPARATUS AND METHOD FOR BURN-IN BOARD ALIGNMENT AND SEALING BETWEE...

CONNECTED OXYGEN THERAPY SYSTEM FOR MAINTAINING PATIENT ENGAGEMENT...

CONNECTED OXYGEN THERAPY SYSTEM FOR CHRONIC RESPIRATORY DISEASE MAN...

APPARATUS, TRANSFER METHOD, CHAMBER AND FRAME FOR SEMICONDUCTOR BUR...

METHODS AND APPARATUS FOR PROVIDING CONCENTRATED THERAPY GAS FOR A...

SMART CHIP PAYMENT ACCEPTANCE

POWER MANAGEMENT IN PORTABLE OXYGEN CONCENTRATORS

METHOD AND SYSTEM FOR USE OF AN EMV CARD IN A MULTI-SIGNATURE WALLE...

ADDITIVE MANUFACTURING DEVICE WITH RELEASE MECHANISM

METHOD AND SYSTEM FOR SECURELY INITIATING A CHECKOUT WITH AN ENROLL...

SYSTEM AND APPLICATION SERVER FOR SECURE GUEST CHECKOUT

SYSTEM AND METHOD FOR CONDUCTING A TRANSANCTION

SYSTEMS, METHODS, AND SOFTWARE FOR PRESENTING PARAMETER SET(S) FOR...

Method and System for Facilitating Mobile Payment for Products

ADDITIVE MANUFACTURING DEVICE WITH RELEASE MECHANISM

Semiconductor Device and Method of Forming Ultra High Density Embed...

ENHANCED WAKE ACTIVATION RESPONSE SPEEDS FOR INDUSTRIAL CONTROL SYS...

Modular Motor Drive Communication System and Method

Semiconductor Device and Method of Forming Ultra High Density Embed...

FLEXIBLE ROUTING FOR CHIP ON BOARD APPLICATIONS

SYSTEMS, METHODS, AND SOFTWARE FOR PRESENTING PARAMETER SET(S) FOR...

PROGRAMMABLE CONTROL MODULE FOR AN INDUSTRIAL DEVICE

PACKAGE-ON-PACKAGE TECHNOLOGY FOR FAN-OUT WAFER-LEVEL PACKAGING

Highly Reliable Low Cost Structure for Wafer-Level Ball Grid Array...

FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME

INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE

Flip chip in package using flexible and removable leadframe

Optical sensor package and method of manufacture

Heat sinking structure