Teck Sim Lee

Person

Malacca, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear spacer for spacing a carrier of a package
- Patent number 11,942,383
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device by using different co...
- Patent number 11,804,424
- Issue date Oct 31, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor assembly and method for fabric...
- Patent number 11,676,881
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with expanded heat spreader
- Patent number 11,600,547
- Issue date Mar 7, 2023
- Infineon Technologies Austria AG
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 11,355,424
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and lead frame design for enhanced creepage and clearance
- Patent number 11,348,866
- Issue date May 31, 2022
- Infineon Technologies Austria AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having a cooling surface and method of m...
- Patent number 10,727,151
- Issue date Jul 28, 2020
- Infineon Technologies AG
- Liu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD package with top side cooling
- Patent number 10,699,978
- Issue date Jun 30, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with improved thermal and electrical performance
- Patent number 10,373,897
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor package with three-terminal clip
- Patent number 10,290,567
- Issue date May 14, 2019
- Infineon Technologies AG
- Rainald Sander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having a repeating footprint pattern
- Patent number 10,204,845
- Issue date Feb 12, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for multiphase circuitry device
- Patent number 10,147,703
- Issue date Dec 4, 2018
- Infineon Technologies AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat slug and rivet free die attach area
- Patent number 10,083,899
- Issue date Sep 25, 2018
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having contact pins at short side edges
- Patent number 10,037,934
- Issue date Jul 31, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having inner and outer semiconductor compon...
- Patent number 9,991,183
- Issue date Jun 5, 2018
- Infineon Technologies Austria AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,978,671
- Issue date May 22, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising side wall marking
- Patent number 9,972,576
- Issue date May 15, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functionalized interface structure
- Patent number 9,922,910
- Issue date Mar 20, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power electronic component with multiple leadframes
- Patent number 9,373,566
- Issue date Jun 21, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electrically isolating shared leads of a lead frame strip
- Patent number 9,324,642
- Issue date Apr 26, 2016
- Infineon Technologies AG
- Frank Püschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 9,263,563
- Issue date Feb 16, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,230,880
- Issue date Jan 5, 2016
- Infineon Technolgies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device comprising non-integer lead pitches and method of m...
- Patent number 9,035,437
- Issue date May 19, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor packages and assembly thereof
- Patent number 8,836,101
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with protruding component portion and method o...
- Patent number 8,664,753
- Issue date Mar 4, 2014
- Infineon Technologies AG
- Teck Sim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package with mold lock opening
- Patent number 8,466,009
- Issue date Jun 18, 2013
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,821,141
- Issue date Oct 26, 2010
- Infineon Technologies AG
- Wae Chet Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with mold lock vent
- Patent number 7,732,937
- Issue date Jun 8, 2010
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...
- Publication number 20240347427
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...
- Publication number 20240312936
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Joon Shyan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240087995
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNE...
- Publication number 20230361009
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Lee Shuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20220157682
- Publication date May 19, 2022
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE
- Publication number 20220148934
- Publication date May 12, 2022
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A U-SHAPED RAIL
- Publication number 20220108949
- Publication date Apr 7, 2022
- INFINEON TECHNOLOGIES AG
- Lee Shuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package and Lead Frame Design for Enhanced Creepage and Clearance
- Publication number 20210391246
- Publication date Dec 16, 2021
- Infineon Technologies Austria AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Device by Using Different Co...
- Publication number 20210175157
- Publication date Jun 10, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Expanded Heat Spreader
- Publication number 20210166988
- Publication date Jun 3, 2021
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package
- Publication number 20210074614
- Publication date Mar 11, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRIC...
- Publication number 20210020539
- Publication date Jan 21, 2021
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMD Package with Top Side Cooling
- Publication number 20190080973
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having a Cooling Surface and Method of M...
- Publication number 20180342438
- Publication date Nov 29, 2018
- INFINEON TECHNOLOGIES AG
- Liu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR MULTIPHASE CIRCUITRY DEVICE
- Publication number 20180277513
- Publication date Sep 27, 2018
- INFINEON TECHNOLOGIES AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT SLUG AND RIVET FREE DIE ATTACH AREA
- Publication number 20180211907
- Publication date Jul 26, 2018
- INFINEON TECHNOLOGIES AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and method of manufacturing the same
- Publication number 20180158758
- Publication date Jun 7, 2018
- Infineon Technologies Austria AG
- Ralf OTREMBA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Package Having a Repeating Footprint Pattern
- Publication number 20180061745
- Publication date Mar 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE
- Publication number 20170179009
- Publication date Jun 22, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Functionalized interface structure
- Publication number 20170098598
- Publication date Apr 6, 2017
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Devices with Increased Creepage Distances
- Publication number 20160365296
- Publication date Dec 15, 2016
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having Contact Pins at Short Side Edges
- Publication number 20160233149
- Publication date Aug 11, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and method of manufacturing the same
- Publication number 20160056092
- Publication date Feb 25, 2016
- Infineon Technologies Austria AG
- Ralf OTREMBA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20150270208
- Publication date Sep 24, 2015
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND LEADFRAME
- Publication number 20150270194
- Publication date Sep 24, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method for Fabricating an Electronic Device
- Publication number 20150214133
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Electrically Isolating Shared Leads of a Lead Frame Strip
- Publication number 20150130037
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Frank Püschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package
- Publication number 20150115313
- Publication date Apr 30, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Teck Sim Lee

Person

Patents Grantslast 30 patents

Package with electrically insulated carrier and at least one step o...

Linear spacer for spacing a carrier of a package

Package with electrically insulated carrier and at least one step o...

Method for fabricating a semiconductor device by using different co...

Semiconductor package, semiconductor assembly and method for fabric...

Semiconductor package with expanded heat spreader

Multi-chip package

Package and lead frame design for enhanced creepage and clearance

Semiconductor chip package having a cooling surface and method of m...

SMD package with top side cooling

Semiconductor devices with improved thermal and electrical performance

Transistor package with three-terminal clip

Semiconductor chip package having a repeating footprint pattern

Semiconductor package for multiphase circuitry device

Semiconductor package with heat slug and rivet free die attach area

Semiconductor chip package having contact pins at short side edges

Semiconductor component having inner and outer semiconductor compon...

Power semiconductor device

Semiconductor chip package comprising side wall marking

Functionalized interface structure

High power electronic component with multiple leadframes

Method of electrically isolating shared leads of a lead frame strip

Semiconductor device package

Electronic device and method for fabricating an electronic device

Packaged device comprising non-integer lead pitches and method of m...

Multi-chip semiconductor packages and assembly thereof

Semiconductor device with protruding component portion and method o...

Method of fabricating a semiconductor package with mold lock opening

Semiconductor device

Semiconductor package with mold lock vent

Patents Applicationslast 30 patents

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...

POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNE...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE

SEMICONDUCTOR PACKAGES INCLUDING A U-SHAPED RAIL

Package and Lead Frame Design for Enhanced Creepage and Clearance

Method for Fabricating a Semiconductor Device by Using Different Co...

Semiconductor Package with Expanded Heat Spreader

Multi-Chip Package

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRIC...

SMD Package with Top Side Cooling

Semiconductor Chip Package Having a Cooling Surface and Method of M...

SEMICONDUCTOR PACKAGE FOR MULTIPHASE CIRCUITRY DEVICE

SEMICONDUCTOR PACKAGE WITH HEAT SLUG AND RIVET FREE DIE ATTACH AREA

Leadframe and method of manufacturing the same

Semiconductor Chip Package Having a Repeating Footprint Pattern

SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE

Functionalized interface structure

Electronic Devices with Increased Creepage Distances

Semiconductor Chip Package Having Contact Pins at Short Side Edges

Leadframe and method of manufacturing the same

POWER SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT AND LEADFRAME

Electronic Device and Method for Fabricating an Electronic Device

Method of Electrically Isolating Shared Leads of a Lead Frame Strip

Semiconductor Device Package