Teh-Tien Su

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Atomic layer etch of tungsten for enhanced tungsten deposition fill
- Patent number 11,069,535
- Issue date Jul 20, 2021
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of tungsten for enhanced tungsten deposition fill
- Patent number 9,972,504
- Issue date May 15, 2018
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of process residues on the backside of a substrate
- Patent number 8,083,963
- Issue date Dec 27, 2011
- Applied Materials, Inc.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma dielectric etch process including ex-situ backside polymer r...
- Patent number 7,276,447
- Issue date Oct 2, 2007
- Applied Materials, Inc.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20220115244
- Publication date Apr 14, 2022
- LAM RESEARCH CORPORATION
- Chiukin Steven LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20210305059
- Publication date Sep 30, 2021
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20200286743
- Publication date Sep 10, 2020
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20180240682
- Publication date Aug 23, 2018
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20170040214
- Publication date Feb 9, 2017
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PERFORMING AN IN SITU CHAMBER CLEAN
- Publication number 20120094499
- Publication date Apr 19, 2012
- Siu Tang Ng
- B08 - CLEANING
Information Patent Application
METHODS OF PROCESSING SUBSTRATES HAVING METAL MATERIALS
- Publication number 20110306215
- Publication date Dec 15, 2011
- Applied Materials, Inc.
- GUOWEN DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ADJUSTING CRITICAL DIMENSION UNIFORMITY IN AN ETCH PROC...
- Publication number 20100003828
- Publication date Jan 7, 2010
- Guowen Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF PROCESS RESIDUES ON THE BACKSIDE OF A SUBSTRATE
- Publication number 20080194111
- Publication date Aug 14, 2008
- APPLIED MATERIALS, INC.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DIELECTRIC ETCH PROCESS INCLUDING EX-SITU BACKSIDE POLYMER R...
- Publication number 20070238305
- Publication date Oct 11, 2007
- APPLIED MATERIALS, INC.
- Gerardo A. Delgadino
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Teh-Tien Su

Person

Patents Grantslast 30 patents

Atomic layer etch of tungsten for enhanced tungsten deposition fill

Atomic layer etching of tungsten for enhanced tungsten deposition fill

Removal of process residues on the backside of a substrate

Plasma dielectric etch process including ex-situ backside polymer r...

Patents Applicationslast 30 patents

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

METHOD OF PERFORMING AN IN SITU CHAMBER CLEAN

METHODS OF PROCESSING SUBSTRATES HAVING METAL MATERIALS

METHODS FOR ADJUSTING CRITICAL DIMENSION UNIFORMITY IN AN ETCH PROC...

REMOVAL OF PROCESS RESIDUES ON THE BACKSIDE OF A SUBSTRATE

PLASMA DIELECTRIC ETCH PROCESS INCLUDING EX-SITU BACKSIDE POLYMER R...