Teikou Odashima

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of resin sealing a gap between a semiconductor chip and a su...
- Patent number 6,436,331
- Issue date Aug 20, 2002
- Towa Corporation
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing semiconductor device and apparatus for res...
- Patent number 5,998,243
- Issue date Dec 7, 1999
- Kabushiki Kaisha Toshiba
- Teikou Odashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL