Membership
Tour
Register
Log in
Tejinder Pal S. Aulakh
Follow
Person
Auburn, WA, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Heat dissipation device loading mechanisms
Patent number
9,565,787
Issue date
Feb 7, 2017
Intel Corporation
Chau V. Ho
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Integrated package insertion and loading mechanism (iPILM)
Patent number
9,496,630
Issue date
Nov 15, 2016
Intel Corporation
Tao Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-array bottom-side connector using spring bias
Patent number
9,490,560
Issue date
Nov 8, 2016
Intel Corporation
Gaurav Chawla
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Integrated package insertion and loading mechanism (iPILM)
Patent number
9,231,318
Issue date
Jan 5, 2016
Intel Corporation
Tao Liu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermal loading mechanism
Patent number
8,816,496
Issue date
Aug 26, 2014
Intel Corporation
Ted Lee
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
HEATSINK STIFFENER METHOD AND APPARATUS
Publication number
20180252483
Publication date
Sep 6, 2018
Intel Corporation
Phil Geng
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
INTEGRATED PACKAGE INSERTION AND LOADING MECHANISM (iPILM)
Publication number
20160190740
Publication date
Jun 30, 2016
Intel Corporation
Tao LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-ARRAY BOTTOM-SIDE CONNECTOR USING SPRING BIAS
Publication number
20160181714
Publication date
Jun 23, 2016
Intel Corporation
GAURAV CHAWLA
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
HEAT DISSIPATION DEVICE LOADING MECHANISMS
Publication number
20140218870
Publication date
Aug 7, 2014
Chau Ho
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
INTEGRATED PACKAGE INSERTION AND LOADING MECHANISM (iPILM)
Publication number
20140199873
Publication date
Jul 17, 2014
Intel Corporation
Tao Liu
H01 - BASIC ELECTRIC ELEMENTS