Tek Seng Tan

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Void reduction in indium thermal interface material
- Patent number 7,999,394
- Issue date Aug 16, 2011
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void reduction in indium thermal interface material
- Patent number 7,651,938
- Issue date Jan 26, 2010
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection of underfill in integrated circuit package
- Patent number 7,622,311
- Issue date Nov 24, 2009
- Advanced Micro Devices, Inc.
- Keng Sang Cha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and fixture for coupling a lid to a support substrate
- Patent number 7,256,065
- Issue date Aug 14, 2007
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LGA fixture for indium assembly process
- Patent number 7,256,067
- Issue date Aug 14, 2007
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Void Reduction in Indium Thermal Interface Material
- Publication number 20100117222
- Publication date May 13, 2010
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inspection of underfill in integrated circuit package
- Publication number 20100055848
- Publication date Mar 4, 2010
- Keng Sang Cha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Void Reduction in Indium Thermal Interface Material
- Publication number 20070284737
- Publication date Dec 13, 2007
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS