Teng-Chun Tsai

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit isolation feature and method of forming the same
- Patent number 12,112,974
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Tang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for gate electrodes
- Patent number 12,080,779
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing slurry composition and method of poli...
- Patent number 12,024,651
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Liao
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor structure with staggered selective growth
- Patent number 12,009,253
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhi-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with a fin and gate structure and method making...
- Patent number 11,961,900
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin isolation structure for FinFET and method of forming the same
- Patent number 11,942,373
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chu-An Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of cutting metal gates and structures formed thereof
- Patent number 11,923,251
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsu-Hsiu Perng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,915,936
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical device having a protrusion source
- Patent number 11,916,131
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- De-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP polishing head design for improving removal rate uniformity
- Patent number 11,865,666
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 11,776,910
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with oxidized ruthenium
- Patent number 11,756,825
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plugs for semiconductor device
- Patent number 11,756,864
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of a polishing pad for chemical mechanical polishing
- Patent number 11,697,183
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Hsuan Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry
- Patent number 11,688,607
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Hung Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fin isolation structure for FinFET and method of forming the same
- Patent number 11,688,644
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chu-An Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy fin structures and methods of forming same
- Patent number 11,664,268
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,557,483
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of cutting metal gates and structures formed thereof
- Patent number 11,545,400
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsu-Hsiu Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP polishing head design for improving removal rate uniformity
- Patent number 11,529,712
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Grant
Materials and methods for chemical mechanical polishing of rutheniu...
- Patent number 11,525,072
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective high-k formation in gate-last process
- Patent number 11,508,583
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yasutoshi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry compositions for chemical mechanical planarization
- Patent number 11,495,471
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- An-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and formation thereof
- Patent number 11,444,028
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hong-Mao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 11,398,381
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for conditioning polishing pad
- Patent number 11,389,928
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Nan Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Integrated circuit isolation feature and method of forming the same
- Patent number 11,387,138
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Tang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry solution for hardened fluid material
- Patent number 11,312,882
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Yin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing slurry composition and method of poli...
- Patent number 11,267,987
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Liao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Spacer structure for semiconductor device
- Patent number 11,264,485
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dummy Fin Structures and Methods of Forming Same
- Publication number 20240387240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING LAYER FOR GUIDE ELECTRODES
- Publication number 20240363726
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure with Staggered Selective Growth
- Publication number 20240332073
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Zhi-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLI...
- Publication number 20240327677
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Liao
- B24 - GRINDING POLISHING
Information Patent Application
Integrated Circuit with a Fin and Gate Structure and Method Making...
- Publication number 20240274694
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME
- Publication number 20240234213
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chu-An LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Vertical Device
- Publication number 20240186400
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- DE-FANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240021501
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partial Barrier Free Vias for Cobalt-Based Interconnects and Method...
- Publication number 20230361042
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of a Polishing Pad for Chemical Mechanical Polishing
- Publication number 20230347471
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- An-Hsuan Lee
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR USING SLURRY
- Publication number 20230290641
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-HUNG LIAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME
- Publication number 20230274982
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chu-An LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Fin Structures and Methods of Forming Same
- Publication number 20230253240
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230146366
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP Polishing Head Design for Improving Removal Rate Uniformity
- Publication number 20230125195
- Publication date Apr 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
Selective High-K Formation in Gate-Last Process
- Publication number 20230077541
- Publication date Mar 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yasutoshi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry Compositions For Chemical Mechanical Planarization
- Publication number 20230058800
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- An-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONDITIONING POLISHING PAD
- Publication number 20220362906
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Nan LEE
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220359202
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ISOLATION FEATURE AND METHOD OF FORMING THE SAME
- Publication number 20220344199
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Tang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLI...
- Publication number 20220195246
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Liao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SPACER STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20220190137
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Han WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING LAYER FOR GATE ELECTRODES
- Publication number 20210384322
- Publication date Dec 9, 2021
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chin-Hsiang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Fin Structures and Methods of Forming Same
- Publication number 20210375667
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with a Fin and Gate Structure and Method Making...
- Publication number 20210288161
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210287904
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Cutting Metal Gates and Structures Formed Thereof
- Publication number 20210280473
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu-Hsiu Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME
- Publication number 20210265222
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chu-An LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partial Barrier Free Vias for Cobalt-Based Interconnects and Method...
- Publication number 20210257302
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective High-K Formation in Gate-Last Process
- Publication number 20210225654
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yasutoshi Okuno
- H01 - BASIC ELECTRIC ELEMENTS

Teng-Chun Tsai

Person

Patents Grantslast 30 patents

Integrated circuit isolation feature and method of forming the same

Capping layer for gate electrodes

Chemical mechanical polishing slurry composition and method of poli...

Semiconductor structure with staggered selective growth

Integrated circuit with a fin and gate structure and method making...

Fin isolation structure for FinFET and method of forming the same

Methods of cutting metal gates and structures formed thereof

Semiconductor structure and manufacturing method thereof

Vertical device having a protrusion source

CMP polishing head design for improving removal rate uniformity

Partial barrier free vias for cobalt-based interconnects and method...

Semiconductor structure with oxidized ruthenium

Contact plugs for semiconductor device

Fabrication of a polishing pad for chemical mechanical polishing

Slurry

Fin isolation structure for FinFET and method of forming the same

Dummy fin structures and methods of forming same

Semiconductor structure and manufacturing method thereof

Methods of cutting metal gates and structures formed thereof

CMP polishing head design for improving removal rate uniformity

Materials and methods for chemical mechanical polishing of rutheniu...

Selective high-k formation in gate-last process

Slurry compositions for chemical mechanical planarization

Contact structure and formation thereof

Method for forming semiconductor structure

Method for conditioning polishing pad

Integrated circuit isolation feature and method of forming the same

CMP slurry solution for hardened fluid material

Chemical mechanical polishing slurry composition and method of poli...

Spacer structure for semiconductor device

Patents Applicationslast 30 patents

Dummy Fin Structures and Methods of Forming Same

CAPPING LAYER FOR GUIDE ELECTRODES

Semiconductor Structure with Staggered Selective Growth

CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLI...

Integrated Circuit with a Fin and Gate Structure and Method Making...

FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME

Method of Forming a Vertical Device

CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

Partial Barrier Free Vias for Cobalt-Based Interconnects and Method...

Fabrication of a Polishing Pad for Chemical Mechanical Polishing

METHOD FOR MANUFACTURING A SEMICONDUCTOR USING SLURRY

FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME

Dummy Fin Structures and Methods of Forming Same

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CMP Polishing Head Design for Improving Removal Rate Uniformity

Selective High-K Formation in Gate-Last Process

Slurry Compositions For Chemical Mechanical Planarization

METHOD FOR CONDITIONING POLISHING PAD

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

INTEGRATED CIRCUIT ISOLATION FEATURE AND METHOD OF FORMING THE SAME

CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLI...

SPACER STRUCTURE FOR SEMICONDUCTOR DEVICE

CAPPING LAYER FOR GATE ELECTRODES

Dummy Fin Structures and Methods of Forming Same

Integrated Circuit with a Fin and Gate Structure and Method Making...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Methods of Cutting Metal Gates and Structures Formed Thereof

FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME

Partial Barrier Free Vias for Cobalt-Based Interconnects and Method...

Selective High-K Formation in Gate-Last Process