Teng Sun

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Chandler, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...
- Publication number 20250218958
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES INCLUDING MICRO-STRUCTURED THIN FILM CAPACITORS
- Publication number 20240421144
- Publication date Dec 19, 2024
- Intel Corporation
- Chun-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS