Teoh Lai Beng

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method of chip positioning for multi-chip packaging
- Patent number 9,196,608
- Issue date Nov 24, 2015
- Cypress Semiconductor Corporation
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip positioning in multi-chip package
- Patent number 8,901,756
- Issue date Dec 2, 2014
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP POSITIONING IN MULTI-CHIP PACKAGE
- Publication number 20150056726
- Publication date Feb 26, 2015
- SPANSION LLC
- Sally FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Positioning in Multi-Chip Package
- Publication number 20140175613
- Publication date Jun 26, 2014
- SPANSION LLC
- Sally FOONG
- H01 - BASIC ELECTRIC ELEMENTS