Teong Guan YEW

Person

Bagan Serai, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Chip assemblies
- Patent number 11,805,602
- Issue date Oct 31, 2023
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded dual-sided interconnect bridges for integrated-circuit pac...
- Patent number 11,562,959
- Issue date Jan 24, 2023
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package with flyover bridge
- Patent number 11,527,481
- Issue date Dec 13, 2022
- Intel Corporation
- Choong Kooi Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively enabling first and second communication paths using a r...
- Patent number 10,084,698
- Issue date Sep 25, 2018
- Intel Corporation
- Amit Kumar Srivastava
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Foldable fabric-based packaging solution
- Patent number 10,014,710
- Issue date Jul 3, 2018
- Intel Corporation
- Bok Eng Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Embedded universal serial bus solutions
- Patent number 9,606,955
- Issue date Mar 28, 2017
- Intel Corporation
- Huimin Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual referenced microstrip
- Patent number 7,109,569
- Issue date Sep 19, 2006
- Intel Corporation
- James Breisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual referenced microstrip
- Patent number 6,686,819
- Issue date Feb 3, 2004
- Intel Corporation
- James Breisch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RECESSED VERTICAL INTERCONNECTS FOR DEVICE MINIATURIZATION
- Publication number 20230112520
- Publication date Apr 13, 2023
- Intel Corporation
- Yee Lun ONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLIES
- Publication number 20220078914
- Publication date Mar 10, 2022
- Intel Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE WITH FLYOVER BRIDGE
- Publication number 20220077070
- Publication date Mar 10, 2022
- Intel Corporation
- Choong Kooi CHEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DUAL-SIDED INTERCONNECT BRIDGES FOR INTEGRATED-CIRCUIT PAC...
- Publication number 20210098375
- Publication date Apr 1, 2021
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE FABRIC-BASED PACKAGING SOLUTION
- Publication number 20170170676
- Publication date Jun 15, 2017
- Intel Corporation
- Bok Eng CHEAH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MEMORY CARD CONNECTOR FOR ELECTRONIC DEVICES
- Publication number 20170003717
- Publication date Jan 5, 2017
- Intel Corporation
- Teong Guan YEW
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELECTIVELY ENABLING FIRST AND SECOND COMMUNICATION PATHS USING A R...
- Publication number 20160285757
- Publication date Sep 29, 2016
- Intel Corporation
- Amit Kumar Srivastava
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Embedded Universal Serial Bus Solutions
- Publication number 20150227489
- Publication date Aug 13, 2015
- Intel Corporation
- Huimin Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Dual referenced microstrip
- Publication number 20040061577
- Publication date Apr 1, 2004
- James Breisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual referenced microstrip
- Publication number 20030146811
- Publication date Aug 7, 2003
- James Breisch
- H01 - BASIC ELECTRIC ELEMENTS

Teong Guan YEW

Person

Patents Grantslast 30 patents

Chip assemblies

Embedded dual-sided interconnect bridges for integrated-circuit pac...

Stacked semiconductor package with flyover bridge

Selectively enabling first and second communication paths using a r...

Foldable fabric-based packaging solution

Embedded universal serial bus solutions

Dual referenced microstrip

Dual referenced microstrip

Patents Applicationslast 30 patents

RECESSED VERTICAL INTERCONNECTS FOR DEVICE MINIATURIZATION

CHIP ASSEMBLIES

STACKED SEMICONDUCTOR PACKAGE WITH FLYOVER BRIDGE

EMBEDDED DUAL-SIDED INTERCONNECT BRIDGES FOR INTEGRATED-CIRCUIT PAC...

FOLDABLE FABRIC-BASED PACKAGING SOLUTION

MEMORY CARD CONNECTOR FOR ELECTRONIC DEVICES

SELECTIVELY ENABLING FIRST AND SECOND COMMUNICATION PATHS USING A R...

Embedded Universal Serial Bus Solutions

Dual referenced microstrip

Dual referenced microstrip