Teppei Kunimune

Person

Tokushima-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal powder sintering paste and method of producing the same, and...
- Patent number 12,125,607
- Issue date Oct 22, 2024
- Nichia Corporation
- Teppei Kunimune
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electrically conductive adhesive and electrically conductive material
- Patent number 11,739,238
- Issue date Aug 29, 2023
- Nichia Corporation
- Teppei Kunimune
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal powder sintering paste and method of producing the same, and...
- Patent number 11,634,596
- Issue date Apr 25, 2023
- Nichia Corporation
- Teppei Kunimune
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electrically conductive adhesive and electrically conductive material
- Patent number 11,162,004
- Issue date Nov 2, 2021
- Nichia Corporation
- Teppei Kunimune
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal powder sintering paste and method of producing the same, and...
- Patent number 10,941,304
- Issue date Mar 9, 2021
- Nichia Corporation
- Teppei Kunimune
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for bonding electronic component and method for manufacturin...
- Patent number 10,875,127
- Issue date Dec 29, 2020
- Nichia Corporation
- Teppei Kunimune
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, and method for manufacturing semiconductor de...
- Patent number 10,707,388
- Issue date Jul 7, 2020
- Nichia Corporation
- Teppei Kunimune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal powder sintering paste, method for producing the same, and me...
- Patent number 10,593,851
- Issue date Mar 17, 2020
- Nichia Corporation
- Teppei Kunimune
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Light emitting semiconductor element bonded to a base by a silver c...
- Patent number 8,836,130
- Issue date Sep 16, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL POWDER SINTERING PASTE AND METHOD OF PRODUCING THE SAME, AND...
- Publication number 20230215596
- Publication date Jul 6, 2023
- Nichia Corporation.
- Teppei KUNIMUNE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
WAVELENGTH CONVERSION MODULE
- Publication number 20230041361
- Publication date Feb 9, 2023
- Nichia Corporation.
- Teppei KUNIMUNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL
- Publication number 20220017793
- Publication date Jan 20, 2022
- Nichia Corporation.
- Teppei KUNIMUNE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL POWDER SINTERING PASTE AND METHOD OF PRODUCING THE SAME, AND...
- Publication number 20210147695
- Publication date May 20, 2021
- Nichia Corporation.
- Teppei KUNIMUNE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR BONDING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURIN...
- Publication number 20190091808
- Publication date Mar 28, 2019
- Nichia Corporation.
- Teppei KUNIMUNE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20190097102
- Publication date Mar 28, 2019
- Nichia Corporation
- Teppei KUNIMUNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL POWDER SINTERING PASTE, METHOD FOR PRODUCING THE SAME, AND ME...
- Publication number 20180315913
- Publication date Nov 1, 2018
- Nichia Corporation.
- Teppei KUNIMUNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL
- Publication number 20180086950
- Publication date Mar 29, 2018
- Nichia Corporation.
- Teppei KUNIMUNE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL POWDER SINTERING PASTE AND METHOD OF PRODUCING THE SAME, AND...
- Publication number 20170283624
- Publication date Oct 5, 2017
- Nichia Corporation.
- Teppei KUNIMUNE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20120153486
- Publication date Jun 21, 2012
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Teppei Kunimune

Person

Patents Grantslast 30 patents

Metal powder sintering paste and method of producing the same, and...

Electrically conductive adhesive and electrically conductive material

Metal powder sintering paste and method of producing the same, and...

Electrically conductive adhesive and electrically conductive material

Metal powder sintering paste and method of producing the same, and...

Method for bonding electronic component and method for manufacturin...

Semiconductor device, and method for manufacturing semiconductor de...

Metal powder sintering paste, method for producing the same, and me...

Light emitting semiconductor element bonded to a base by a silver c...

Patents Applicationslast 30 patents

METAL POWDER SINTERING PASTE AND METHOD OF PRODUCING THE SAME, AND...

WAVELENGTH CONVERSION MODULE

ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL

METAL POWDER SINTERING PASTE AND METHOD OF PRODUCING THE SAME, AND...

METHOD FOR BONDING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURIN...

SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DE...

METAL POWDER SINTERING PASTE, METHOD FOR PRODUCING THE SAME, AND ME...

ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL

METAL POWDER SINTERING PASTE AND METHOD OF PRODUCING THE SAME, AND...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR