Teppei Uchimura

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Hamamatsui-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of etching backside Si substrate of SOI substrate to expose...
- Patent number 9,240,505
- Issue date Jan 19, 2016
- TOHOKU UNIVERSITY
- Tadahiro Ohmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra high-speed wet etching apparatus
- Patent number 8,728,338
- Issue date May 20, 2014
- National University Corporation Tohoku University
- Tadahiro Ohmi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF ETCHING OF SOI SUBSTRATE, AND BACK-ILLUMINATED PHOTOELECT...
- Publication number 20130320477
- Publication date Dec 5, 2013
- TOHOKU UNIVERSITY
- Tadahiro Ohmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA HIGH-SPEED WET ETCHING APPARATUS
- Publication number 20130244442
- Publication date Sep 19, 2013
- Tadahiro Ohmi
- H01 - BASIC ELECTRIC ELEMENTS