Teppo SYRJÄNEN

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Patents Grantslast 30 patents

Information Patent Grant
Shielded electronic component
- Patent number 12,075,603
- Issue date Aug 27, 2024
- Murata Manufacturing Co., Ltd.
- Teppo Syrjänen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with internal shielding
- Patent number 12,075,605
- Issue date Aug 27, 2024
- Murata Manufacturing Co., Ltd.
- Teppo Syrjänen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MEMS COMPONENT WITH UPSIDE-DOWN CHIP
- Publication number 20240391759
- Publication date Nov 28, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SHIELDED ELECTRONIC COMPONENT
- Publication number 20240381598
- Publication date Nov 14, 2024
- Murata Manufacturing Co., Ltd.
- Teppo SYRJÄNEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT WITH ALIGNED DIE
- Publication number 20230360945
- Publication date Nov 9, 2023
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT
- Publication number 20220304200
- Publication date Sep 22, 2022
- Murata Manufacturing Co., Ltd.
- Teppo SYRJÄNEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT WITH INTERNAL SHIELDING
- Publication number 20220248576
- Publication date Aug 4, 2022
- Murata Manufacturing Co., Ltd.
- Teppo SYRJÄNEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR