TERANCE B. BLAKE

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PALATINE, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Modulation of background substitution based on camera attitude and...
- Patent number 9,253,416
- Issue date Feb 2, 2016
- Motorola Solutions, Inc.
- Gregory J. Dunn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device recruitment for stereoscopic imaging applications
- Patent number 8,504,640
- Issue date Aug 6, 2013
- Motorola Solutions, Inc.
- Edward Rios
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Temporary storage or specialized transmission of multi-microphone s...
- Patent number 8,036,716
- Issue date Oct 11, 2011
- Motorola Solutions, Inc.
- Gregory J. Dunn
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Corrosion-resistant copper bond pad and integrated device
- Patent number 7,078,796
- Issue date Jul 18, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Gregory J. Dunn
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DEVICE RECRUITMENT FOR STEREOSCOPIC IMAGING APPLICATIONS
- Publication number 20100306335
- Publication date Dec 2, 2010
- MOTOROLA, INC.
- EDWARD RIOS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULATION OF BACKGROUND SUBSTITUTION BASED ON CAMERA ATTITUDE AND...
- Publication number 20090315915
- Publication date Dec 24, 2009
- MOTOROLA, INC.
- GREGORY J. DUNN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEMPORARY STORAGE OR SPECIALIZED TRANSMISSION OF MULTI-MICROPHONE S...
- Publication number 20090197564
- Publication date Aug 6, 2009
- MOTOROLA, INC.
- GREGORY J. DUNN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Corrosion-resistant bond pad and integrated device
- Publication number 20050104207
- Publication date May 19, 2005
- Timothy B. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corrosion-resistant bond pad and integrated device
- Publication number 20050001316
- Publication date Jan 6, 2005
- MOTOROLA, INC.
- Timothy B. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corrosion-resistant copper bond pad and integrated device
- Publication number 20050001324
- Publication date Jan 6, 2005
- MOTOROLA, INC.
- Gregory J. Dunn
- G01 - MEASURING TESTING