Terence Cheung

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Toronto, CA

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Patents Grantslast 30 patents

Information Patent Grant
Under bump metallization for on-die capacitor
- Patent number 8,314,474
- Issue date Nov 20, 2012
- ATI Technologies ULC
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip substrate with multi-capacitor footprint
- Patent number 8,012,874
- Issue date Sep 6, 2011
- ATI Technologies ULC
- Yue Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Under Bump Metallization for On-Die Capacitor
- Publication number 20100019347
- Publication date Jan 28, 2010
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Substrate with Multi-Capacitor Footprint
- Publication number 20090152690
- Publication date Jun 18, 2009
- Yue Li
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Under Bump Routing Layer Method and Apparatus
- Publication number 20090032941
- Publication date Feb 5, 2009
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS