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Terence Cheung
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San Diego, CA, US
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last 30 patents
Information
Patent Grant
Semi-embedded trace structure with partially buried traces
Patent number
11,764,076
Issue date
Sep 19, 2023
QUALCOMM Incorporated
Kuiwon Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Passive component embedded in an embedded trace substrate (ETS)
Patent number
11,552,023
Issue date
Jan 10, 2023
QUALCOMM Incorporated
Kuiwon Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device comprising first solder interconnects aligned in a first dir...
Patent number
11,437,307
Issue date
Sep 6, 2022
QUALCOMM Incorporated
Abdolreza Langari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device comprising first solder interconnects aligned in a first dir...
Patent number
10,916,494
Issue date
Feb 9, 2021
QUALCOMM Incorporated
Abdolreza Langari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management circuit board for stacked semiconductor chip device
Patent number
9,209,106
Issue date
Dec 8, 2015
ATI Technologies ULC
Xiao Ling Shi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
SEMI-EMBEDDED TRACE STRUCTURE WITH PARTIALLY BURIED TRACES
Publication number
20220172963
Publication date
Jun 2, 2022
QUALCOMM Incorporated
Kuiwon KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVE COMPONENT EMBEDDED IN AN EMBEDDED TRACE SUBSTRATE (ETS)
Publication number
20210407918
Publication date
Dec 30, 2021
QUALCOMM Incorporated
Kuiwon KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIR...
Publication number
20210066177
Publication date
Mar 4, 2021
QUALCOMM Incorporated
Abdolreza LANGARI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIR...
Publication number
20200211943
Publication date
Jul 2, 2020
QUALCOMM Incorporated
Abdolreza LANGARI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT CIRCUIT BOARD FOR STACKED SEMICONDUCTOR CHIP D...
Publication number
20130343000
Publication date
Dec 26, 2013
Xiao Ling Shi
H01 - BASIC ELECTRIC ELEMENTS