Terh Kuen YII

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Kuala Lumpur, MY

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Patents Grantslast 30 patents

Information Patent Grant
Delamination resistant device package having raised bond surface an...
- Patent number 8,736,042
- Issue date May 27, 2014
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination resistant device package having low moisture sensitivity
- Patent number 8,097,934
- Issue date Jan 17, 2012
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TO263 device package having low moisture sensitivity
- Patent number 7,838,980
- Issue date Nov 23, 2010
- National Semiconductor Corporation
- Yee Kim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe panel for power packages
- Patent number 7,763,958
- Issue date Jul 27, 2010
- National Semiconductor Corporation
- Peng Soon Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe panel
- Patent number 7,714,418
- Issue date May 11, 2010
- National Semiconductor Corporation
- Peng Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical leadless leadframe package
- Patent number 7,582,954
- Issue date Sep 1, 2009
- National Semiconductor Corporation
- Peng Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AN...
- Publication number 20120080781
- Publication date Apr 5, 2012
- National Semiconductor Corporation
- Felix C. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL LEADLESS LEADFRAME PACKAGE
- Publication number 20090212382
- Publication date Aug 27, 2009
- National Semiconductor Corporation
- Peng Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PANEL
- Publication number 20090026590
- Publication date Jan 29, 2009
- National Semiconductor Corporation
- Peng Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS