Terrence C. Caskey

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Mesa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Vibratable die attachment tool
- Patent number 7,147,735
- Issue date Dec 12, 2006
- Intel Corporation
- Terrence C. Caskey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
No-flow underfill materials for flip chips
- Publication number 20060097403
- Publication date May 11, 2006
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vibratable die attachment tool
- Publication number 20060016541
- Publication date Jan 26, 2006
- Terrence C. Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device with reduced entrapment of material between die a...
- Publication number 20050104180
- Publication date May 19, 2005
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS