Terrence E. Lewis

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Connector for sending power to an IC-chip thru two pressed joints i...
- Patent number 6,336,815
- Issue date Jan 8, 2002
- Unisys Corporation
- Mark DeWayne Bestul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for sending power to an IC-chip thru four pressed joints...
- Patent number 6,302,703
- Issue date Oct 16, 2001
- Unisys Corporation
- Mark DeWayne Bestul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for making multiple pressed co-axial connections having a...
- Patent number 6,247,939
- Issue date Jun 19, 2001
- Unisys Corporation
- Mark DeWayne Bestul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package incorporating low-stress omnidirectional...
- Patent number 4,611,238
- Issue date Sep 9, 1986
- Burroughs Corporation
- Terrence E. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 4,139,859
- Issue date Feb 13, 1979
- Burroughs Corporation
- Terrence E. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 3,999,285
- Issue date Dec 28, 1976
- Burroughs Corporation
- Terrence E. Lewis
- H01 - BASIC ELECTRIC ELEMENTS