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Terry Lee Sterrett
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Cave Creek, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Interconnection designs and materials having improved strength and...
Patent number
9,136,239
Issue date
Sep 15, 2015
Micron Technology, Inc.
Terry Lee Sterrett
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Interconnection designs and materials having improved strength and...
Patent number
8,642,462
Issue date
Feb 4, 2014
Micorn Technology, Inc.
Terry Lee Sterrett
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Low temperature bumping process
Patent number
7,718,216
Issue date
May 18, 2010
Intel Corporation
Terry Lee Sterrett
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Etched interposer for integrated circuit devices
Patent number
7,592,704
Issue date
Sep 22, 2009
Intel Corporation
Terry L. Sterrett
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer-level underfill process making use of sacrificial contact pad...
Patent number
7,530,164
Issue date
May 12, 2009
Intel Corporation
Paul Koning
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low temperature bumping process
Patent number
7,521,115
Issue date
Apr 21, 2009
Intel Corporation
Terry Lee Sterrett
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Etched interposer for integrated circuit devices
Patent number
7,413,995
Issue date
Aug 19, 2008
Intel Corporation
Terry L. Sterrett
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnection designs and materials having improved strength and...
Patent number
7,387,827
Issue date
Jun 17, 2008
Intel Corporation
Terry Lee Sterrett
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Stackable integrated circuit packaging
Patent number
7,345,361
Issue date
Mar 18, 2008
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and devices for supporting substrates using fluids
Patent number
7,144,299
Issue date
Dec 5, 2006
Intel Corporation
Leonel R. Arana
B24 - GRINDING POLISHING
Information
Patent Grant
Wafer-level underfill process making use of sacrificial contact pad...
Patent number
7,059,048
Issue date
Jun 13, 2006
Intel Corporation
Paul Koning
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for improving an integrated circuit device
Patent number
7,000,821
Issue date
Feb 21, 2006
Intel Corporation
Terry Sterrett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface treatment for microelectronic device substrate
Patent number
6,794,225
Issue date
Sep 21, 2004
Intel Corporation
Rahul Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device with covalently bonded connection structure
Patent number
6,586,843
Issue date
Jul 1, 2003
Intel Corporation
Terry Sterrett
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTERCONNECTION DESIGNS AND MATERIALS HAVING IMPROVED STRENGTH AND...
Publication number
20140203430
Publication date
Jul 24, 2014
Micron Technology, Inc.
Terry Lee Sterrett
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
ETCHED INTERPOSER FOR INTEGRATED CIRCUIT DEVICES
Publication number
20080265391
Publication date
Oct 30, 2008
Terry L. STERRETT
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERCONNECTION DESIGNS AND MATERIALS HAVING IMPROVED STRENGTH AND...
Publication number
20080254611
Publication date
Oct 16, 2008
Intel Corporation (a Delaware corporation)
TERRY LEE STERRETT
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
IMPLANTABLE MEDICAL DEVICE HOUSING REINFORCEMENT
Publication number
20080186691
Publication date
Aug 7, 2008
John C. Mertz
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
LOW TEMPERATURE BUMPING PROCESS
Publication number
20070148360
Publication date
Jun 28, 2007
Intel Corporation
Terry Lee Sterrett
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
METHODS AND DEVICES FOR SUPPORTING SUBSTRATES USING FLUIDS
Publication number
20060252354
Publication date
Nov 9, 2006
Leonel R. Arana
B24 - GRINDING POLISHING
Information
Patent Application
Wafer-level underfill process making use of sacrificial contact pad...
Publication number
20060121646
Publication date
Jun 8, 2006
Paul Koning
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thinning semiconductor wafers
Publication number
20060046433
Publication date
Mar 2, 2006
Terry L. Sterrett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Etched interposer for integrated circuit devices
Publication number
20060038303
Publication date
Feb 23, 2006
Terry L. Sterrett
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Stackable integrated circuit packaging
Publication number
20050121764
Publication date
Jun 9, 2005
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution of substrate interconnects
Publication number
20050104187
Publication date
May 19, 2005
Cynthia H. Polsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress compensation layer systems for improved second level solder...
Publication number
20050068757
Publication date
Mar 31, 2005
Saikumar Jayaraman
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Modular device assemblies
Publication number
20040262728
Publication date
Dec 30, 2004
Terry L. Sterrett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface treatment for microelectronic device substrate
Publication number
20040121512
Publication date
Jun 24, 2004
Rahul Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnection designs and materials having improved strength and...
Publication number
20040115409
Publication date
Jun 17, 2004
Intel Corporation
Terry Lee Sterrett
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Low temperature bumping process
Publication number
20040115408
Publication date
Jun 17, 2004
Intel Corporation
Terry Lee Sterrett
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Method and apparatus for improving an integrated circuit device
Publication number
20040104261
Publication date
Jun 3, 2004
Terry Sterrett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-level underfill process and device for cpu and non-cpu applic...
Publication number
20030226254
Publication date
Dec 11, 2003
Paul Koning
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for improving an integrated circuit device
Publication number
20030087475
Publication date
May 8, 2003
Terry Sterrett
H01 - BASIC ELECTRIC ELEMENTS