TERRY SHING WANG

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IRVINE, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
De-mountable, solderless in-line lead module package with interface
- Patent number 6,614,659
- Issue date Sep 2, 2003
- Delphi Technologies, Inc.
- Haim Feigenbaum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump contact force concentration system and method
- Patent number 6,595,785
- Issue date Jul 22, 2003
- Delphi Technologies, Inc.
- Eric D. Jensen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Z-axis electrical interconnect
- Patent number 6,358,064
- Issue date Mar 19, 2002
- Delphi Technologies, Inc.
- John Steven Szalay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly
- Patent number 6,086,385
- Issue date Jul 11, 2000
- Delphi Technologies, Inc.
- Terry Shing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board to flexible printed circuit connection system
- Patent number 6,033,234
- Issue date Mar 7, 2000
- Packard Hughes Interconnect Company
- Terry Shing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile clamping mechanism for connecting a printed circuit boa...
- Patent number 5,971,772
- Issue date Oct 26, 1999
- Packard Hughes Interconnect Company
- Terry Shing Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DE-MOUNTABLE, SOLDERLESS IN-LINE LEAD MODULE PACKAGE WITH INTERFACE
- Publication number 20030107874
- Publication date Jun 12, 2003
- Haim Feigenbaum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump contact force concentration system and method
- Publication number 20030068905
- Publication date Apr 10, 2003
- Eric D. Jensen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Z-AXIS ELECTRICAL INTERCONNECT
- Publication number 20010041465
- Publication date Nov 15, 2001
- JOHN STEVEN SZALAY
- H01 - BASIC ELECTRIC ELEMENTS