Terry Sparks

Person

Niskayuna, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor structure
- Patent number 8,587,070
- Issue date Nov 19, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Terry Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor structure
- Patent number 8,105,890
- Issue date Jan 31, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Terry Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pseudo hybrid structure for low K interconnect integration
- Patent number 7,955,968
- Issue date Jun 7, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Pak K. Leung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a continuous layer of a first metal selectively o...
- Patent number 7,935,631
- Issue date May 3, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Terry Sparks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive via formation utilizing electroplating
- Patent number 7,741,218
- Issue date Jun 22, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Terry G. Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a contact on a backside of a die
- Patent number 7,544,605
- Issue date Jun 9, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Terry G. Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication process for modifying the profiles of pat...
- Patent number 6,884,727
- Issue date Apr 26, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Da Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication method for making small features
- Patent number 6,858,542
- Issue date Feb 22, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Terry G. Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a passivation layer for air gap formation
- Patent number 6,838,354
- Issue date Jan 4, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Cindy K. Goldberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, memory cell, and processes for forming them
- Patent number 6,686,633
- Issue date Feb 3, 2004
- Motorola, Inc.
- Craig S. Lage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an opening in a semiconductor device substrate
- Patent number 6,566,264
- Issue date May 20, 2003
- Motorola, Inc.
- Nigel Graeme Cave
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 6,372,665
- Issue date Apr 16, 2002
- Motorola Inc.
- Joy Kimi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a semiconductor device and a process for operat...
- Patent number 6,245,686
- Issue date Jun 12, 2001
- Motorola Inc.
- Jeffrey D. Rose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 6,232,235
- Issue date May 15, 2001
- Motorola, Inc.
- Nigel Graeme Cave
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a semiconductor device having an interconnect o...
- Patent number 6,184,073
- Issue date Feb 6, 2001
- Motorola, Inc.
- Craig S. Lage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 6,127,258
- Issue date Oct 3, 2000
- Motorola Inc.
- Joy Kimi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a low dielectric constant inter-level inte...
- Patent number 5,880,018
- Issue date Mar 9, 1999
- Motorola Inc.
- Bruce Allen Boeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20120126289
- Publication date May 24, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Terry Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH METHOD IN THE MANUFACTURE OF AN INTEGRATED CIRCUIT
- Publication number 20110027999
- Publication date Feb 3, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Terry G. Sparks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pseudo Hybrid Structure for Low K Interconnect Integration
- Publication number 20100227471
- Publication date Sep 9, 2010
- Pak K. Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Implant Imaging with Spin-on Hard Masks
- Publication number 20090325106
- Publication date Dec 31, 2009
- Willard E. Conley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Forming a Noble Metal Layer, Notably on In...
- Publication number 20080224314
- Publication date Sep 18, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Terry Sparks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONDUCTIVE VIA FORMATION UTILIZING ELECTROPLATING
- Publication number 20080206984
- Publication date Aug 28, 2008
- Terry G. Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Structure
- Publication number 20080207004
- Publication date Aug 28, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Terry Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CONTACT ON A BACKSIDE OF A DIE
- Publication number 20080119046
- Publication date May 22, 2008
- Terry G. Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A THROUGH-SUBSTRATE VIA
- Publication number 20080113505
- Publication date May 15, 2008
- Terry G. Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor fabrication method for making small features
- Publication number 20040142576
- Publication date Jul 22, 2004
- Terry G. Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a passivation layer for air gap formation and st...
- Publication number 20040119134
- Publication date Jun 24, 2004
- Cindy K. Goldberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor fabrication process for modifying the profiles of pat...
- Publication number 20040038536
- Publication date Feb 26, 2004
- Da Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Terry Sparks

Person

Patents Grantslast 30 patents

Method of forming a semiconductor structure

Method of forming a semiconductor structure

Pseudo hybrid structure for low K interconnect integration

Method of forming a continuous layer of a first metal selectively o...

Conductive via formation utilizing electroplating

Method of making a contact on a backside of a die

Semiconductor fabrication process for modifying the profiles of pat...

Semiconductor fabrication method for making small features

Method for forming a passivation layer for air gap formation

Semiconductor device, memory cell, and processes for forming them

Method for forming an opening in a semiconductor device substrate

Method for forming a semiconductor device

Process for forming a semiconductor device and a process for operat...

Method of forming a semiconductor device

Process for forming a semiconductor device having an interconnect o...

Method for forming a semiconductor device

Method for manufacturing a low dielectric constant inter-level inte...

Patents Applicationslast 30 patents

METHOD OF FORMING A SEMICONDUCTOR STRUCTURE

ETCH METHOD IN THE MANUFACTURE OF AN INTEGRATED CIRCUIT

Pseudo Hybrid Structure for Low K Interconnect Integration

Method for Implant Imaging with Spin-on Hard Masks

Method and Apparatus for Forming a Noble Metal Layer, Notably on In...

CONDUCTIVE VIA FORMATION UTILIZING ELECTROPLATING

Method of Forming a Semiconductor Structure

METHOD OF MAKING A CONTACT ON A BACKSIDE OF A DIE

METHOD OF FORMING A THROUGH-SUBSTRATE VIA

Semiconductor fabrication method for making small features

Method for forming a passivation layer for air gap formation and st...

Semiconductor fabrication process for modifying the profiles of pat...