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Teruaki Chino
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Nagano, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Bump structure, wiring substrate, semiconductor apparatus and bump...
Patent number
9,485,864
Issue date
Nov 1, 2016
Shinko Electric Industries Co., Ltd.
Kei Imafuji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate and semiconductor device
Patent number
9,380,712
Issue date
Jun 28, 2016
SHINKO ELECTRIC INDSTRIES CO., LTD.
Teruaki Chino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Resin sealing method of semiconductor device
Patent number
8,610,292
Issue date
Dec 17, 2013
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
8,536,715
Issue date
Sep 17, 2013
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with its surface edge covered by resin
Patent number
8,436,471
Issue date
May 7, 2013
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing same
Patent number
8,431,441
Issue date
Apr 30, 2013
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin sealing method of semiconductor device
Patent number
8,368,235
Issue date
Feb 5, 2013
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
Patent number
8,344,492
Issue date
Jan 1, 2013
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board and electronic component device
Patent number
8,334,461
Issue date
Dec 18, 2012
Shinko Electric Industries Co., Ltd.
Yuichi Taguchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
8,293,576
Issue date
Oct 23, 2012
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin sealing method of semiconductor device
Patent number
7,985,629
Issue date
Jul 26, 2011
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked package and method for manufacturing the package
Patent number
7,928,557
Issue date
Apr 19, 2011
Shinko Electric Industries Co., Ltd.
Kiyoshi Oi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
BUMP STRUCTURE, WIRING SUBSTRATE, SEMICONDUCTOR APPARATUS AND BUMP...
Publication number
20150029689
Publication date
Jan 29, 2015
Shinko Electric Industries Co., Ltd.
Kei IMAFUJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
Publication number
20140146503
Publication date
May 29, 2014
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN SEALING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20130082378
Publication date
Apr 4, 2013
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20120306100
Publication date
Dec 6, 2012
Shinko Electric Industries Co., Ltd.
Teruaki CHINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
Publication number
20110272800
Publication date
Nov 10, 2011
SHINKO ELECTRIC INDUSTRIES CO,LTD.
Teruaki CHINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20110079913
Publication date
Apr 7, 2011
Shinko Electric Industries Co., Ltd.
Teruaki CHINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20110062578
Publication date
Mar 17, 2011
Shinko Electric Industries Co., Ltd.
Fumimasa Katagiri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
Publication number
20110049726
Publication date
Mar 3, 2011
Shinko Electric Industries Co., Ltd.
Teruaki CHINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF COM...
Publication number
20100267208
Publication date
Oct 21, 2010
Shinko Electric Industries Co., Ltd.
Kiyoshi Oi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...
Publication number
20100200975
Publication date
Aug 12, 2010
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN SEALING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20100184256
Publication date
Jul 22, 2010
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN SEALING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20100167469
Publication date
Jul 1, 2010
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
Publication number
20090141464
Publication date
Jun 4, 2009
Shinko Electric Industries Co., Ltd.
Yuichi TAGUCHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMPONENT FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF COM...
Publication number
20090121341
Publication date
May 14, 2009
Shinko Electric Industries Co., Ltd.
Kiyoshi Oi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...
Publication number
20080303153
Publication date
Dec 11, 2008
Shinko Electric Industries Co., Ltd.
Kiyoshi Oi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED PACKAGE AND METHOD FOR MANUFACTURING THE PACKAGE
Publication number
20080142944
Publication date
Jun 19, 2008
Kiyoshi Oi
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...