Teruaki Kasai

Person

Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor laser device
- Patent number 11,228,159
- Issue date Jan 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kouji Oomori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser device
- Patent number 11,133,644
- Issue date Sep 28, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kouji Oomori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser apparatus and method for manufacturing same
- Patent number 8,897,328
- Issue date Nov 25, 2014
- Panasonic Corporation
- Takayuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component bonding method, component laminating method and bonded co...
- Patent number 8,614,118
- Issue date Dec 24, 2013
- Panasonic Corporation
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip pickup apparatus, chip pickup method, chip releasing device an...
- Patent number 8,192,578
- Issue date Jun 5, 2012
- Panasonic Corporation
- Hiroshi Haji
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for picking up semiconductor chip and suction...
- Patent number 7,632,374
- Issue date Dec 15, 2009
- Panasonic Corporation
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for picking up semiconductor chip
- Patent number 7,306,695
- Issue date Dec 11, 2007
- Matsushita Electric Industrial Co., Ltd.
- Teruaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of transferring conductive balls and apparatus...
- Patent number 6,390,351
- Issue date May 21, 2002
- Matsushita Electric Industrial Co., Ltd.
- Teruaki Kasai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting conductive ball
- Patent number 6,237,219
- Issue date May 29, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kazuo Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive metal ball attaching apparatus and method, and bump form...
- Patent number 5,601,229
- Issue date Feb 11, 1997
- Matsushita Electric Industrial Co., Ltd.
- Siniti Nakazato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR LASER DEVICE
- Publication number 20200136343
- Publication date Apr 30, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- KOUJI OOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LASER DEVICE
- Publication number 20200136344
- Publication date Apr 30, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- KOUJI OOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LASER APPARATUS AND METHOD FOR MANUFACTURING SAME
- Publication number 20140211819
- Publication date Jul 31, 2014
- PANASONIC CORPORATION
- Takayuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AN...
- Publication number 20090279995
- Publication date Nov 12, 2009
- PANASONIC CORPORATION
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PICKUP METHOD, ELECTRONIC COMPONENT MOUNTING M...
- Publication number 20090202333
- Publication date Aug 13, 2009
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Bonding Method, Component Laminating Method And Bonded Co...
- Publication number 20090035892
- Publication date Feb 5, 2009
- Matsushita Electric Industrial Co. Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Pickup Method, Electronic Component Mounting M...
- Publication number 20090000109
- Publication date Jan 1, 2009
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for picking up semiconductor chip
- Publication number 20040238117
- Publication date Dec 2, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Teruaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for picking up semiconductor chip and suction...
- Publication number 20040038498
- Publication date Feb 26, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS

Teruaki Kasai

Person

Patents Grantslast 30 patents

Semiconductor laser device

Semiconductor laser device

Semiconductor laser apparatus and method for manufacturing same

Component bonding method, component laminating method and bonded co...

Chip pickup apparatus, chip pickup method, chip releasing device an...

Method and apparatus for picking up semiconductor chip and suction...

Apparatus and method for picking up semiconductor chip

Apparatus and method of transferring conductive balls and apparatus...

Method of mounting conductive ball

Conductive metal ball attaching apparatus and method, and bump form...

Patents Applicationslast 30 patents

SEMICONDUCTOR LASER DEVICE

SEMICONDUCTOR LASER DEVICE

SEMICONDUCTOR LASER APPARATUS AND METHOD FOR MANUFACTURING SAME

CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AN...

ELECTRONIC COMPONENT PICKUP METHOD, ELECTRONIC COMPONENT MOUNTING M...

Component Bonding Method, Component Laminating Method And Bonded Co...

Electronic Component Pickup Method, Electronic Component Mounting M...

Apparatus and method for picking up semiconductor chip

Method and apparatus for picking up semiconductor chip and suction...